公开(公告)号：US20140138849A1

公开(公告)日：2014-05-22

申请号：US14162959

申请日：2014-01-24

Applicant: HARRIS CORPORATION

Inventor： LOUIS JOSEPH RENDEK, JR. ,  MICHAEL RAYMOND WEATHERSPOON ,  CASEY PHILIP RODRIGUEZ ,  DAVID NICOL

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L23/3157 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/33 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/11422 ,  H01L2224/1148 ,  H01L2224/13021 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0306 ,  H05K3/281 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0141 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/49144 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/31721 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2924/00

Abstract: A method for making an electronic device includes forming an interconnect layer stack on a rigid wafer substrate having a plurality of patterned electrical conductor layers, a dielectric layer between adjacent patterned electrical conductor layers, and at least one solder pad on an uppermost patterned electrical conductor layer. An LCP solder mask having at least one aperture therein alignable with the at least one solder pad is formed. The LCP solder mask and interconnect layer stack are aligned and laminated together. Solder is positioned in the at least one aperture. At least one circuit component is attached to the at least one solder pad using the solder.

Abstract translation: 制造电子器件的方法包括在刚性晶片衬底上形成互连层堆叠，所述刚性晶片衬底具有多个图案化电导体层，相邻图案化电导体层之间的介电层，以及位于最上图案化电导体层上的至少一个焊盘 。 形成具有与至少一个焊盘对准的至少一个孔的LCP焊接掩模。 将LCP焊接掩模和互连层堆叠对齐并层压在一起。 焊料定位在至少一个孔中。 使用焊料将至少一个电路部件连接到至少一个焊盘。