Abstract:
An imprint apparatus (100, 100', 200, 220) and method 300 employ an effective pressure P eff in imprint lithography. The imprint apparatus (100, 100', 200, 220) includes a compressible chamber (111) that encloses an imprint mold (120, 228a) having a mold pattern (122) and a sample (130, 228b) to be imprinted (300). The chamber (111) is compressed (330, 340, 350) to imprint (360) the mold pattern (122) on the sample (130, 228b). The mold (120, 228a) is pressed (350) against the sample (130, 228b) with the effective pressure P eff . The effective pressure P eff is controlled by a selected ratio A cavity /A contact of a cavity area A cavity of the chamber (111) to a contact area A contact between the mold (120, 228a) and the sample (130, 228b).