公开(公告)号：US10114433B2

公开(公告)日：2018-10-30

申请号：US15120511

申请日：2014-04-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Thomas Robert Bowden ,  Allen B Doerr ,  John Franz ,  Melvin K Benedict ,  Joseph Allen ,  John Norton ,  Binh Nguyen

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/18 ,  H01L23/367 ,  H01L23/40 ,  G06F13/42

Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.