公开(公告)号：WO2017048232A1

公开(公告)日：2017-03-23

申请号：PCT/US2015/050124

申请日：2015-09-15

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： BARNETTE, Christopher M. ,  FITZGERALD, William K. ,  DAY, Michael

IPC: H05K3/42 ,  H05K3/46

CPC classification number: H05K1/113 ,  H05K1/0298 ,  H05K2201/09227 ,  H05K2201/09254 ,  H05K2201/10159 ,  H05K2201/10189

Abstract: Various examples provide a printed circuit board (PCB) comprising a first route from a first through-hole via to a second through-hole via, and a second route from the second through-hole via to a first microvia (e.g., coupled to a second memory module socket). Additional microvias may have a route from the first microvia that effectively daisy chains the microvias from the second through-hold via. Various examples also provide a PCB comprising a first route from a first through-hole via to a second through-hole via, and a second route from the second through-hole via to a first sequential lamination via. Additional sequential lamination vias may have a route from the first microvia that effectively daisy chains the sequential lamination vias from the second through-hold via.

Abstract translation: 各种示例提供了一种印刷电路板（PCB），其包括从第一通孔通孔到第二通孔通孔的第一路线，以及从第二通孔通孔到第一微孔的第二路线（例如，耦合到 第二个内存模块插槽）。 另外的微孔可以具有来自第一微孔的路线，其有效地将来自第二通过保持通孔的微血管连锁。 各种示例还提供了一种PCB，其包括从第一通孔通孔到第二通孔通孔的第一路线，以及从第二通孔过孔到第一顺序层压通路的第二路线。 附加的顺序层压通孔可以具有来自第一微孔的路线，其有效地将连续层压通孔从第二贯通保持通孔中链接。