公开(公告)号：US10705578B2

公开(公告)日：2020-07-07

申请号：US16191916

申请日：2018-11-15

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  William K. Norton ,  Ernesto Ferrer Medina

IPC: G06F1/20 ,  H05K1/02 ,  H05K7/20 ,  G11C5/04 ,  H01L27/108 ,  H01L23/473 ,  H01L23/427

Abstract: A system for cooling memory modules mounted in parallel on a printed circuit board may include a coolant tube installed in parallel between two of the memory modules, and a heat spreader disposed in parallel between the two memory modules. The heat spreader may include a base having an outer surface thermally coupled to the coolant tube and first and second fins. The first fin has a first spring force toward a first of the two memory modules. The first spring force causes the first fin to provide contact pressure to the first memory module to thermally couple the first fin and the first memory module. The second fin has a second spring force toward a second of the two memory modules. The second spring force causes the second fin to provide contact pressure to the second memory module to thermally couple the second fin and the second memory module.

公开(公告)号：US20200159294A1

公开(公告)日：2020-05-21

申请号：US16191916

申请日：2018-11-15

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  William K. Norton ,  Ernesto Ferrer Medina

IPC: G06F1/20 ,  G11C5/04 ,  H01L27/108 ,  H05K1/02

Abstract: A system for cooling memory modules mounted in parallel on a printed circuit board may include a coolant tube installed in parallel between two of the memory modules, and a heat spreader disposed in parallel between the two memory modules. The heat spreader may include a base having an outer surface thermally coupled to the coolant tube and first and second fins. The first fin has a first spring force toward a first of the two memory modules. The first spring force causes the first fin to provide contact pressure to the first memory module to thermally couple the first fin and the first memory module. The second fin has a second spring force toward a second of the two memory modules. The second spring force causes the second fin to provide contact pressure to the second memory module to thermally couple the second fin and the second memory module.

公开(公告)号：US10185375B2

公开(公告)日：2019-01-22

申请号：US15550500

申请日：2015-02-13

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John Franz ,  Tahir Cader ,  William K. Norton

IPC: H05K7/20 ,  G06F1/20 ,  F28D15/00 ,  G05D23/19

Abstract: An example method includes positioning a thermal bus bar into a bus bar support channel of a cooling wall, the cooling wall comprising a plurality of thermal bus bars. The positioning comprises removably connecting first portions of at least two dripless connectors coupled to a fluid flow path of the thermal bus bar to second portions of the dripless connectors coupled to coolant transport lines that receive and return coolant from a coolant source. The method further includes flowing coolant received from the coolant transport lines through the fluid flow path and returning the coolant to the coolant transport lines. The thermal bus bar is positioned while coolant provided by the coolant transport lines is flowing through other thermal bus bars of the cooling wall.

公开(公告)号：US20200260617A1

公开(公告)日：2020-08-13

申请号：US15774300

申请日：2016-02-16

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Zheila N. Madanipour ,  William K. Norton ,  Wade D. Vinson

IPC: H05K7/20 ,  G06F1/20

Abstract: In some examples, a controller for air and liquid cooling of electrical equipment is provided. The controller can include a cooling profile assignment module to assign a hybrid cooling profile based on temperature readings of electrical equipment; an air cooling control module to control a forced airflow cooling system for the electrical equipment in accordance with the assigned hybrid cooling profile; and a liquid cooling control module to control a liquid cooling system for the electrical equipment in accordance with the assigned hybrid cooling profile. The assigned hybrid cooling profile can indicate that the forced airflow cooling system is to be used as a primary cooling system for the electrical equipment unless temperature readings indicate that a heat profile of the electrical equipment is above a thermal threshold.

公开(公告)号：US20180017490A1

公开(公告)日：2018-01-18

申请号：US15211875

申请日：2016-07-15

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  John Franz ,  William K. Norton

IPC: G01N21/59 ,  G01N21/47 ,  G01N21/55 ,  G01N27/10

CPC classification number: G01N21/59 ,  G01N21/4738 ,  G01N21/85 ,  G01N21/94 ,  G01N2201/12

Abstract: Example implementations relate to an optical biofilm probe. For example, in an implementation, the optical biofilm probe may include a light source to project light towards a substrate disposed within a bypass and a detector to detect light from the substrate. Properties of light detected by the detector may be affected by biofilm formation on the substrate. The bypass may be connected in parallel to a conduit of a fluid system.

公开(公告)号：US11523544B2

公开(公告)日：2022-12-06

申请号：US15774300

申请日：2016-02-16

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Zheila N. Madanipour ,  William K. Norton ,  Wade D. Vinson

IPC: G06F1/20 ,  H05K7/20

Abstract: In some examples, a controller for air and liquid cooling of electrical equipment is provided. The controller can include a cooling profile assignment module to assign a hybrid cooling profile based on temperature readings of electrical equipment; an air cooling control module to control a forced airflow cooling system for the electrical equipment in accordance with the assigned hybrid cooling profile; and a liquid cooling control module to control a liquid cooling system for the electrical equipment in accordance with the assigned hybrid cooling profile. The assigned hybrid cooling profile can indicate that the forced airflow cooling system is to be used as a primary cooling system for the electrical equipment unless temperature readings indicate that a heat profile of the electrical equipment is above a thermal threshold.

公开(公告)号：US20180032113A1

公开(公告)日：2018-02-01

申请号：US15550500

申请日：2015-02-13

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John Franz ,  Tahir Cader ,  William K. Norton

IPC: G06F1/20 ,  G05D23/19 ,  H05K7/20

CPC classification number: G06F1/20 ,  F28D15/00 ,  G05D23/1928 ,  G06F2200/201 ,  H05K7/20 ,  H05K7/20781

Abstract: An example method includes positioning a thermal bus bar into a bus bar support channel of a cooling wall, the cooling wall comprising a plurality of thermal bus bars. The positioning comprises removably connecting first portions of at least two dripless connectors coupled to a fluid flow path of the thermal bus bar to second portions of the dripless connectors coupled to coolant transport lines that receive and return coolant from a coolant source. The method further includes flowing coolant received from the coolant transport lines through the fluid flow path and returning the coolant to the coolant transport lines. The thermal bus bar is positioned while coolant provided by the coolant transport lines is flowing through other thermal bus bars of the cooling wall.

公开(公告)号：US20180027696A1

公开(公告)日：2018-01-25

申请号：US15546544

申请日：2015-03-24

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader ,  William K. Norton

IPC: H05K7/20

CPC classification number: H05K7/20254 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20272 ,  H05K7/20772 ,  H05K7/20781

Abstract: Example implementations relate to liquid cooling with a cooling chamber. For example, a system for liquid cooling with a cooling chamber can include a liquid cooling chamber in contact with a heat generating device within a computing device, the liquid cooling chamber to contain a liquid coolant and transfer heat from the heat generating device into a liquid circulation loop extending around a perimeter of the liquid cooling chamber. The system for liquid cooling with a cooling chamber can further include a comb structure adjacent to the liquid cooling chamber to transfer heat into the liquid circulation loop, and a liquid exit pipe coupled to the liquid circulation loop to direct a flow of the liquid coolant.