公开(公告)号：EP2670598A4

公开(公告)日：2018-02-28

申请号：EP11857598

申请日：2011-01-31

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： BENGALI SADIQ ,  COOK GALEN P ,  CUMBIE MICHAEL W ,  MESSENGER ROBERT K

IPC: B41J2/175 ,  B41J2/045

CPC classification number: B41J2/05 ,  B41J2/14129 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2/1628 ,  B41J2/1645 ,  B41J2002/14467

Abstract: In one embodiment, a fluid ejection device includes a substrate with a fluid slot and a membrane adhered to the substrate that spans the fluid slot. A resistor is disposed on top of the membrane over the fluid slot, and a fluid feed hole next to the resistor extends through the membrane to the slot. A shelf extends from the edge of the resistor to the edge of the feed hole, and a passivation layer covers the resistor and part the shelf. An etch-resistant layer is formed partly on the shelf and in between the fluid feed hole and the resistor.