-
1.发明公开MOLDED FLUID FLOW STRUCTURE WITH SAW CUT CHANNEL 审中-公开GEFORMTEFLÜSSIGKEITSSTRÖMUNGSSTRUKTURMITSÄGESCHNITTKANAL
公开(公告)号：EP2961608A4
公开(公告)日：2017-08-02
申请号：EP13876374
申请日：2013-06-27
Applicant: HEWLETT-PACKARD DEV COMPANY L P
Inventor： CHEN CHIEN-HUA , CUMBIE MICHAEL W , AGARWAL ARUN K
CPC classification number: B41J2/1632 , B29C69/001 , B41J2/14016 , B41J2/1404 , B41J2/14145 , B41J2/14201 , B41J2/1433 , B41J2/155 , B41J2/1601 , B41J2/1603 , B41J2/1607 , B41J2/162 , B41J2/1623 , B41J2/1628 , B41J2/1637 , B41J2/1645 , B41J2002/14419 , B41J2002/14491 , B41J2202/19 , B41J2202/20 , H05K1/186 , H05K3/284 , H05K3/32 , H05K3/4007 , H05K2203/0228 , H05K2203/1316
Abstract: In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.
Abstract translation: 在一个示例中，用于制造微型器件组件的工艺包括将微型器件放置在印刷电路板的前部上，在包围微型器件的印刷电路板上模制模制件，然后形成通往微型器件的通道 印刷电路板的后部。
-
2.发明公开
公开(公告)号：EP2961605A4
公开(公告)日：2017-03-01
申请号：EP13876301
申请日：2013-12-19
Applicant: HEWLETT-PACKARD DEV COMPANY L P
Inventor： CHEN CHIEN-HUA , CUMBIE MICHAEL W
CPC classification number: B41J2/14 , B41J2/1404 , B41J2/14129 , B41J2/14145 , B41J2/14201 , B41J2/1433 , B41J2/145 , B41J2/155 , B41J2/1603 , B41J2/1607 , B41J2/1637 , B41J25/34 , B41J2002/14419 , B41J2202/20
Abstract: In one example, a fluid flow structure includes a micro device embedded in a molding having a channel therein through which fluid may flow directly into the device and/or onto the device.
Abstract translation: 在一个示例中，流体喷射装置包括嵌入印刷电路板中的打印头芯片。 流体可以通过印刷电路板中的插入式流体供给槽并进入打印头芯片而流过打印头芯片。
-
公开(公告)号：EP2670598A4
公开(公告)日：2018-02-28
申请号：EP11857598
申请日：2011-01-31
Applicant: HEWLETT-PACKARD DEV COMPANY L P
Inventor： BENGALI SADIQ , COOK GALEN P , CUMBIE MICHAEL W , MESSENGER ROBERT K
CPC classification number: B41J2/05 , B41J2/14129 , B41J2/1603 , B41J2/1626 , B41J2/1628 , B41J2/1645 , B41J2002/14467
Abstract: In one embodiment, a fluid ejection device includes a substrate with a fluid slot and a membrane adhered to the substrate that spans the fluid slot. A resistor is disposed on top of the membrane over the fluid slot, and a fluid feed hole next to the resistor extends through the membrane to the slot. A shelf extends from the edge of the resistor to the edge of the feed hole, and a passivation layer covers the resistor and part the shelf. An etch-resistant layer is formed partly on the shelf and in between the fluid feed hole and the resistor.
-
4.发明公开ENCAPSULATING A BONDED WIRE WITH LOW PROFILE ENCAPSULATION 审中-公开VERKAPSELUNG EINES GEBONDETEN DRAHTES MIT FLACHER VERKAPSELUNG
公开(公告)号：EP3063008A4
公开(公告)日：2017-08-16
申请号：EP13896622
申请日：2013-10-28
Applicant: HEWLETT-PACKARD DEV COMPANY L P
Inventor： CHEN CHIEN-HUA , CUMBIE MICHAEL W , ZHANG ZHUQING
CPC classification number: B41J2/1433 , B41J2/14024 , B41J2/14072 , B41J2/1601 , B41J2/1623 , H01L21/56 , H01L21/67126 , H01L24/48 , H01L24/85 , H01L2224/4382 , H01L2224/45005 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48157 , H01L2224/4845 , H01L2224/48464 , H01L2224/8592 , H01L2924/01004 , H01L2924/01047 , H01L2924/10253 , H01L2924/00014
Abstract: Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.
Abstract translation: 用低轮廓封装封装键合线包括在与第一端上的管芯连接的键合线上和第二端上的电路组件上施加封装，并截断封装的形状以形成截头形状。
-
公开(公告)号：EP2961611A4
公开(公告)日：2017-06-14
申请号：EP13876732
申请日：2013-07-29
Applicant: HEWLETT-PACKARD DEV COMPANY L P
Inventor： CHEN CHIEN-HUA , CUMBIE MICHAEL W
CPC classification number: B41J2/1632 , B29C69/001 , B41J2/14016 , B41J2/1404 , B41J2/14145 , B41J2/14201 , B41J2/1433 , B41J2/155 , B41J2/1601 , B41J2/1603 , B41J2/1607 , B41J2/162 , B41J2/1623 , B41J2/1628 , B41J2/1637 , B41J2/1645 , B41J2002/14419 , B41J2002/14491 , B41J2202/19 , B41J2202/20 , H05K1/186 , H05K3/284 , H05K3/32 , H05K3/4007 , H05K2203/0228 , H05K2203/1316
Abstract: In an embodiment, a fluid flow structure includes a micro device embedded in a molding. A fluid feed hole is formed through the micro device, and a saw defined fluid channel is cut through the molding to fluidically couple the fluid feed hole with the channel.
Abstract translation: 在一个示例中，用于制造微型器件组件的工艺包括将微型器件放置在印刷电路板的前部上，在包围微型器件的印刷电路板上模制模制件，然后形成通往微型器件的通道 印刷电路板的后部。
-
Patent Agency Ranking
公开(公告)号：EP3099494A4
公开(公告)日：2017-10-04
申请号：EP14881108
申请日：2014-01-28
Applicant: HEWLETT-PACKARD DEV COMPANY L P
Inventor： CHEN CHIEN-HUA , GROH MICHAEL G , CUMBIE MICHAEL W
CPC classification number: B41J2/1433 , B41J2/1601 , B41J2/1623 , B41J2/1637 , B41J2002/14491
Abstract: An example system includes a flexible carrier and a printhead flow structure. The printhead flow structure includes a flex circuit including a carrier wafer and at least one printhead die electrically coupled to the flex circuit. The carrier wafer is bonded to the flexible carrier with thermal release tape, the thermal release tape to debond substantially completely from the flex circuit at a debonding temperature via bending of the flexible carrier.
Abstract translation: 本公开包括柔性载体以及包括柔性载体的系统和方法。
-
公开(公告)号：EP2961606A4
公开(公告)日：2017-07-05
申请号：EP13876203
申请日：2013-06-17
Applicant: HEWLETT-PACKARD DEV COMPANY L P
Inventor： CHEN CHIEN-HUA , CUMBIE MICHAEL W , CHOY SILAM J
IPC: B41J2/14
CPC classification number: B41J2/14 , B41J2/1404 , B41J2/14129 , B41J2/14145 , B41J2/14201 , B41J2/1433 , B41J2/145 , B41J2/155 , B41J2/1603 , B41J2/1607 , B41J2/1637 , B41J25/34 , B41J2002/14419 , B41J2202/20
Abstract: In one example, a fluid flow structure includes a micro device embedded in a molding having a channel therein through which fluid may flow directly into the device and/or onto the device.
Abstract translation: 在一个示例中，流体喷射装置包括嵌入印刷电路板中的印刷头模具。 流体可以通过印刷电路板中的切入式流体供给槽流入打印头模具并流入打印头模具。
-
公开(公告)号：EP3134264A4
公开(公告)日：2018-02-14
申请号：EP14890338
申请日：2014-04-25
Applicant: HEWLETT-PACKARD DEV COMPANY L P
Inventor： CUMBIE MICHAEL W , CLARK GARRETT E , MACKENZIE MARK H
CPC classification number: B41J2/04545 , B41J2/0458 , B41J2/04581
Abstract: Selecting nozzles can include selecting nozzles of a plurality of nozzles to print a portion of a print job based on content of the print job and assigning firing reservations to the selected nozzles, where a total number of the firing reservations assigned to the selected nozzles is comparatively less than a total number of the plurality of nozzles.
-
公开(公告)号：EP3134267A4
公开(公告)日：2017-12-27
申请号：EP14890175
申请日：2014-04-24
Applicant: HEWLETT-PACKARD DEV COMPANY L P
Inventor： CHEN CHIEN-HUA , CUMBIE MICHAEL W , MOUREY DEVIN ALEXANDER
CPC classification number: B41J2/17553 , B41J2/14145 , B41J2/1601 , B41J2/1623 , B41J2/17513 , B41J2/17559 , B41J2002/14362
Abstract: An ink delivery device is described. The ink delivery device includes an ink die with a first surface. The ink delivery device also includes an overmold to encapsulate a number of surfaces of the ink die. The overmold has a second surface that is wider than the first surface. The second surface receives an adhesive to attach the ink delivery device to a printhead. The ink delivery device also includes an ink slot passing through the overmold and at least a portion of the ink die.
-
10.发明公开MOLDED DIE SLIVERS WITH EXPOSED FRONT AND BACK SURFACES 审中-公开AUS EINER MATRIZE GEFORMTEFASERBÄNDERMIT UNVERDECKTEN VORDER- UNDHINTERFLÄCHEN
公开(公告)号：EP2976221A4
公开(公告)日：2017-06-28
申请号：EP14770591
申请日：2014-03-18
Applicant: HEWLETT-PACKARD DEV COMPANY L P
Inventor： CHEN CHIEN-HUA , CUMBIE MICHAEL W
IPC: B41J2/14
CPC classification number: B29C33/0033 , B29C39/02 , B29C39/26 , B29C39/36 , B29L2031/767 , B41J2/1601 , B41J2/1607 , B41J2/1623 , B41J2/1628 , B41J2/1637
Abstract: In one example, a process for making a micro device structure includes molding a micro device in a monolithic body of material and forming a fluid flow passage in the body through which fluid can pass directly to the micro device.
Abstract translation: 在一个示例中，用于制造微型器件结构的工艺包括在微型器件的单体中模制微型器件，并且在体内形成流体流动通道，流体可以通过该流体通道直接通向微型器件。
-
-
-
-
-
-
-
-
-
Search Results
19
records
(took 0.03 seconds)
