公开(公告)号：EP3142861A4

公开(公告)日：2018-01-24

申请号：EP14818797

申请日：2014-05-12

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： CHEN CHIEN-HUA ,  STRAND THOMAS R ,  GROH MICHAEL G

IPC: B41M5/00 ,  B41J2/135

CPC classification number: B41J2/1433 ,  B41J2/1404 ,  B41J2/14072 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1632 ,  B41J2/1637 ,  B41J2/1645 ,  B41J2002/14411 ,  B41J2202/19 ,  B41J2202/20

Abstract: In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.