公开(公告)号：EP3063008A4

公开(公告)日：2017-08-16

申请号：EP13896622

申请日：2013-10-28

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： CHEN CHIEN-HUA ,  CUMBIE MICHAEL W ,  ZHANG ZHUQING

IPC: B41J2/045 ,  B41J2/05

CPC classification number: B41J2/1433 ,  B41J2/14024 ,  B41J2/14072 ,  B41J2/1601 ,  B41J2/1623 ,  H01L21/56 ,  H01L21/67126 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/4382 ,  H01L2224/45005 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48157 ,  H01L2224/4845 ,  H01L2224/48464 ,  H01L2224/8592 ,  H01L2924/01004 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/00014

Abstract: Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.

Abstract translation: 用低轮廓封装封装键合线包括在与第一端上的管芯连接的键合线上和第二端上的电路组件上施加封装，并截断封装的形状以形成截头形状。

公开(公告)号：EP2961611A4

公开(公告)日：2017-06-14

申请号：EP13876732

申请日：2013-07-29

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： CHEN CHIEN-HUA ,  CUMBIE MICHAEL W

IPC: B41J2/16 ,  B41J2/045 ,  B41J2/14

CPC classification number: B41J2/1632 ,  B29C69/001 ,  B41J2/14016 ,  B41J2/1404 ,  B41J2/14145 ,  B41J2/14201 ,  B41J2/1433 ,  B41J2/155 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1637 ,  B41J2/1645 ,  B41J2002/14419 ,  B41J2002/14491 ,  B41J2202/19 ,  B41J2202/20 ,  H05K1/186 ,  H05K3/284 ,  H05K3/32 ,  H05K3/4007 ,  H05K2203/0228 ,  H05K2203/1316

Abstract: In an embodiment, a fluid flow structure includes a micro device embedded in a molding. A fluid feed hole is formed through the micro device, and a saw defined fluid channel is cut through the molding to fluidically couple the fluid feed hole with the channel.

Abstract translation: 在一个示例中，用于制造微型器件组件的工艺包括将微型器件放置在印刷电路板的前部上，在包围微型器件的印刷电路板上模制模制件，然后形成通往微型器件的通道 印刷电路板的后部。

公开(公告)号：EP3134267A4

公开(公告)日：2017-12-27

申请号：EP14890175

申请日：2014-04-24

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： CHEN CHIEN-HUA ,  CUMBIE MICHAEL W ,  MOUREY DEVIN ALEXANDER

IPC: B41J2/175 ,  B41J2/135 ,  B41J2/14 ,  B41J2/16

CPC classification number: B41J2/17553 ,  B41J2/14145 ,  B41J2/1601 ,  B41J2/1623 ,  B41J2/17513 ,  B41J2/17559 ,  B41J2002/14362

Abstract: An ink delivery device is described. The ink delivery device includes an ink die with a first surface. The ink delivery device also includes an overmold to encapsulate a number of surfaces of the ink die. The overmold has a second surface that is wider than the first surface. The second surface receives an adhesive to attach the ink delivery device to a printhead. The ink delivery device also includes an ink slot passing through the overmold and at least a portion of the ink die.

公开(公告)号：EP2976221A4

公开(公告)日：2017-06-28

申请号：EP14770591

申请日：2014-03-18

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： CHEN CHIEN-HUA ,  CUMBIE MICHAEL W

IPC: B41J2/14

CPC classification number: B29C33/0033 ,  B29C39/02 ,  B29C39/26 ,  B29C39/36 ,  B29L2031/767 ,  B41J2/1601 ,  B41J2/1607 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1637

Abstract: In one example, a process for making a micro device structure includes molding a micro device in a monolithic body of material and forming a fluid flow passage in the body through which fluid can pass directly to the micro device.

Abstract translation: 在一个示例中，用于制造微型器件结构的工艺包括在微型器件的单体中模制微型器件，并且在体内形成流体流动通道，流体可以通过该流体通道直接通向微型器件。

公开(公告)号：EP2961609A4

公开(公告)日：2017-06-28

申请号：EP13876407

申请日：2013-09-27

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： CHOY SILAM J ,  CUMBIE MICHAEL W ,  MOUREY DEVIN ALEXANDER ,  CHEN CHIEN-HUA

IPC: B41J2/045 ,  B41J2/14

CPC classification number: B41J2/17526 ,  B41J2/14072 ,  B41J2/14145 ,  B41J2/1433 ,  B41J2/155 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/1628 ,  B41J2/1637 ,  B41J2/17553 ,  B41J2002/14362 ,  B41J2002/14419 ,  B41J2202/20

Abstract: A structure (10) includes a printhead die (12) molded into a monolithic body (14) of plastic, wherein the monolithic body (14) has a channel (16) in contact with the die (12) so that fluid may pass directly to the die (12).

Abstract translation: 在一些示例中，打印流体盒包括壳体和由壳体支撑的组件。 所述组件包括模制件，流体分配模具，所述流体分配模具具有前部和后部，所述前部包括用于从所述流体分配模具分配印刷流体的孔口，所述流体分配模具嵌入所述模制件中，所述流体分配模块包括通道以将流体传送至流体分配 除了在通道处之外，流体分配模具的前部暴露在模制件外部并且流体分配模具的后部由模制件覆盖。 该组件还包括第一外部电触点和非流体分配模具电子设备，该第一外部电触点电连接到流体分配模并且暴露在模制件外部以连接到该组件的外部电路，该非流体分配模电子设备埋置在模制件中并且电连接到第一外部 电接触。

公开(公告)号：EP2961612A4

公开(公告)日：2017-06-21

申请号：EP13876231

申请日：2013-03-20

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： CHEN CHIEN-HUA ,  CUMBIE MICHAEL W ,  AGARWAL ARUN K

IPC: B41J2/045 ,  B41J2/14 ,  B41J2/155 ,  B41J2/16 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32 ,  H05K3/40

CPC classification number: B41J2/1632 ,  B29C69/001 ,  B41J2/14016 ,  B41J2/1404 ,  B41J2/14145 ,  B41J2/14201 ,  B41J2/1433 ,  B41J2/155 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1637 ,  B41J2/1645 ,  B41J2002/14419 ,  B41J2002/14491 ,  B41J2202/19 ,  B41J2202/20 ,  H05K1/186 ,  H05K3/284 ,  H05K3/32 ,  H05K3/4007 ,  H05K2203/0228 ,  H05K2203/1316

Abstract: In an embodiment, a fluid flow structure includes a micro device embedded in a molding. A fluid feed hole is formed through the micro device, and a saw defined fluid channel is cut through the molding to fluidically couple the fluid feed hole with the channel.

Abstract translation: 在一个示例中，用于制造微型器件组件的工艺包括将微型器件放置在印刷电路板的前部上，在包围微型器件的印刷电路板上模制模制件，然后形成通往微型器件的通道 印刷电路板的后部。

公开(公告)号：EP3142861A4

公开(公告)日：2018-01-24

申请号：EP14818797

申请日：2014-05-12

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： CHEN CHIEN-HUA ,  STRAND THOMAS R ,  GROH MICHAEL G

IPC: B41M5/00 ,  B41J2/135

CPC classification number: B41J2/1433 ,  B41J2/1404 ,  B41J2/14072 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1632 ,  B41J2/1637 ,  B41J2/1645 ,  B41J2002/14411 ,  B41J2202/19 ,  B41J2202/20

Abstract: In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.

公开(公告)号：EP3134266A4

公开(公告)日：2017-12-20

申请号：EP14889794

申请日：2014-04-22

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： CHEN CHIEN-HUA ,  CUMBIE MICHAEL ,  HAMMERSTAD DIANE

IPC: B41J2/175 ,  B41J2/14 ,  B41J2/17

CPC classification number: B41J2/1433 ,  B41J2/1404 ,  B41J2002/14419 ,  B41J2202/20

Abstract: In one example, a fluid flow structure includes a fluid dispensing micro device embedded in a molding having a channel therein through which fluid may flow directly to the device. The device contains multiple fluid ejectors and multiple fluid chambers each near an ejector. Each chamber has an inlet through which fluid from the channel may enter the chamber and an outlet through which fluid may be ejected from the chamber. A perimeter of the channel surrounds the inlets but is otherwise unconstrained in size by the size of the device.

公开(公告)号：EP2961608A4

公开(公告)日：2017-08-02

申请号：EP13876374

申请日：2013-06-27

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： CHEN CHIEN-HUA ,  CUMBIE MICHAEL W ,  AGARWAL ARUN K

IPC: B41J2/045 ,  B41J2/14

CPC classification number: B41J2/1632 ,  B29C69/001 ,  B41J2/14016 ,  B41J2/1404 ,  B41J2/14145 ,  B41J2/14201 ,  B41J2/1433 ,  B41J2/155 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1637 ,  B41J2/1645 ,  B41J2002/14419 ,  B41J2002/14491 ,  B41J2202/19 ,  B41J2202/20 ,  H05K1/186 ,  H05K3/284 ,  H05K3/32 ,  H05K3/4007 ,  H05K2203/0228 ,  H05K2203/1316

Abstract: In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.

Abstract translation: 在一个示例中，用于制造微型器件组件的工艺包括将微型器件放置在印刷电路板的前部上，在包围微型器件的印刷电路板上模制模制件，然后形成通往微型器件的通道 印刷电路板的后部。

公开(公告)号：EP2961605A4

公开(公告)日：2017-03-01

申请号：EP13876301

申请日：2013-12-19

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： CHEN CHIEN-HUA ,  CUMBIE MICHAEL W

IPC: B41J2/04 ,  B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14 ,  B41J2/1404 ,  B41J2/14129 ,  B41J2/14145 ,  B41J2/14201 ,  B41J2/1433 ,  B41J2/145 ,  B41J2/155 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/1637 ,  B41J25/34 ,  B41J2002/14419 ,  B41J2202/20

Abstract: In one example, a fluid flow structure includes a micro device embedded in a molding having a channel therein through which fluid may flow directly into the device and/or onto the device.

Abstract translation: 在一个示例中，流体喷射装置包括嵌入印刷电路板中的打印头芯片。 流体可以通过印刷电路板中的插入式流体供给槽并进入打印头芯片而流过打印头芯片。