公开(公告)号：WO2020162928A1

公开(公告)日：2020-08-13

申请号：PCT/US2019/016857

申请日：2019-02-06

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： FULLER, Anthony M. ,  FORREST, Daren L. ,  CUMBIE, Michael W. ,  GROOM, Michael ,  JENSSEN, Conrad

IPC: B41J2/14

Abstract: A device includes a plurality of fluid ejection dies, wherein each of the fluid ejection dies includes a contact pad and a plurality of fluid actuation devices. The device includes an electrical interconnect element in contact with the contact pad of each of the fluid ejection dies to electrically interconnect the plurality of fluid ejection dies.

公开(公告)号：WO2021080600A1

公开(公告)日：2021-04-29

申请号：PCT/US2019/058050

申请日：2019-10-25

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： SCHWEITZER, Paul David ,  QUINN, Max Richard ,  FORREST, Daren L. ,  JOHNSON, Thomas Stafford

IPC: B41J2/175 ,  B41J2/14 ,  H01L21/56 ,  H05K3/24

Abstract: Examples of electrical connectors are provided herein. In some examples, an electrical connector includes a contact pad at a first end of a route. In some examples, the electrical connector includes a bond at a second end of the route. In some examples, the contact pad and the bond include a copper layer on a substrate, a nickel layer on the copper layer, and a gold layer on the nickel layer. In some examples, the gold layer has a first thickness on the contact pad and has a second thickness on the bond. In some examples, the second thickness is greater than the first thickness.

公开(公告)号：EP3727864A1

公开(公告)日：2020-10-28

申请号：EP19706183.1

申请日：2019-02-06

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： FULLER, Anthony M. ,  FORREST, Daren L. ,  CUMBIE, Michael W. ,  GROOM, Michael ,  JENSSEN, Conrad

IPC: B41J2/14