3D BUILD PLATFORM REFILL OPENING AND CAP
    3.
    发明申请
    3D BUILD PLATFORM REFILL OPENING AND CAP 审中-公开
    3D BUILD PLATFORM补充开口和CAP

    公开(公告)号:WO2017196347A1

    公开(公告)日:2017-11-16

    申请号:PCT/US2016/032133

    申请日:2016-05-12

    Abstract: In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.

    Abstract translation: 在示例实现中,装置包括构建平台和帽。 构建平台在顶面上具有开口以填充构建材料存储单元。 将盖子插入开口以密封开口。 当盖子插入开口时,盖子的顶部表面和构建平台的顶部表面具有均匀的导热性。

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