公开(公告)号：WO2015030803A1

公开(公告)日：2015-03-05

申请号：PCT/US2013/057610

申请日：2013-08-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP

Inventor： SADIK, Patrick Wayne ,  MCKAY, Roger A Jr

IPC: B81C1/00 ,  H01L21/302 ,  H01L21/306

CPC classification number: B81C1/00063 ,  B41J2/162 ,  B41J2/1626 ,  B81B2201/052 ,  B81C2201/0115 ,  B81C2201/0133 ,  B81C2201/0181

Abstract: An example provides a method including sputtering a metal catalyst onto a substrate, exposing the substrate to a solution that reacts with the metal catalyst to form a plurality of pores in the substrate, and etching the substrate to remove the plurality of pores to form a recess in the substrate.

Abstract translation: 一个实例提供了一种方法，包括：将金属催化剂溅射到衬底上，将衬底暴露于与金属催化剂反应以在衬底中形成多个孔的溶液中，并且蚀刻衬底以去除 多个孔隙以在衬底中形成凹陷。