3.
    发明专利
    未知

    公开(公告)号:DK146219C

    公开(公告)日:1984-01-02

    申请号:DK174676

    申请日:1976-04-14

    Applicant: HOECHST AG

    Abstract: Phosphorus nitrides of the general formula PNx, in which x stands for a number of 0.9 up to 1.7 are made. To this end, phosphorus halides are reacted with ammonia in gas phase, the ammonia being used in excess based on the phosphorus halides, and the resulting reaction product is heated to temperatures of up to 950 DEG C until ammonia practically ceases to be evolved from the reaction product.

    5.
    发明专利
    未知

    公开(公告)号:DK146219B

    公开(公告)日:1983-08-01

    申请号:DK174676

    申请日:1976-04-14

    Applicant: HOECHST AG

    Abstract: Phosphorus nitrides of the general formula PNx, in which x stands for a number of 0.9 up to 1.7 are made. To this end, phosphorus halides are reacted with ammonia in gas phase, the ammonia being used in excess based on the phosphorus halides, and the resulting reaction product is heated to temperatures of up to 950 DEG C until ammonia practically ceases to be evolved from the reaction product.

    PROCESS FOR MAKING SELF-EXTINGUISHING SYNTHETIC RESIN LAMINATES, AND LAMINATES MADE THEREBY

    公开(公告)号:GB2000472B

    公开(公告)日:1982-01-20

    申请号:GB7828156

    申请日:1978-06-28

    Applicant: HOECHST AG

    Abstract: Self-extinguishing laminates are made by an improved process, wherein individual layers of a carrier material are impregnated with a thermosetting phenolic resin containing a flame-retardant agent and the impregnated layers are placed one above another and bonded together by compressing them at elevated temperature and under elevated pressure to give a hardened laminate. More specifically, finely pulverulent phosphorus pentanitride as a flame-retarding agent is dispersed in the plasticized or non-plasticized thermosetting phenolic resin, with or without a diluent; the phenolic resin, based on its solid matter content, and the phosphorus pentanitride being used in an approximate ratio by weight of 100:4 to 100:15; and the phenolic resin, based on its solid matter content, and the carrier being used in an approximate ratio by weight of 100:80 to 100:150.

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