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公开(公告)号:CA2133422A1
公开(公告)日:1993-10-03
申请号:CA2133422
申请日:1993-03-19
Applicant: HOECHST AG
Inventor: KUEHN HEINRICH , BOS ULRICH , HANNSS CARSTEN , VON KAYSER KARL-FRIEDRICH
Abstract: PCT No. PCT/EP93/00675 Sec. 371 Date Sep. 30, 1994 Sec. 102(e) Date Sep. 30, 1994 PCT Filed Mar. 19, 1993 PCT Pub. No. WO93/20255 PCT Pub. Date Oct. 14, 1993The invention relates to a process for producing a strong bond between copper layers, which have been applied by means of thermal spraying of pulverulent copper or copper alloys, and ceramic. Fine copper powder having a mean particle diameter of
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公开(公告)号:ES2121996T3
公开(公告)日:1998-12-16
申请号:ES93906570
申请日:1993-03-19
Applicant: HOECHST AG
Inventor: KUHN HEINRICH , BOS ULRICH , HANNSS CARSTEN , VON KAYSER KARL-FRIEDRICH
Abstract: PCT No. PCT/EP93/00675 Sec. 371 Date Sep. 30, 1994 Sec. 102(e) Date Sep. 30, 1994 PCT Filed Mar. 19, 1993 PCT Pub. No. WO93/20255 PCT Pub. Date Oct. 14, 1993The invention relates to a process for producing a strong bond between copper layers, which have been applied by means of thermal spraying of pulverulent copper or copper alloys, and ceramic. Fine copper powder having a mean particle diameter of
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公开(公告)号:NO943647A
公开(公告)日:1994-09-30
申请号:NO943647
申请日:1994-09-30
Applicant: HOECHST AG
Inventor: KUHN HEINRICH , BOS ULRICH , HANNSS CARSTEN , KAYSER KARL-FRIEDRICH VON
CPC classification number: C04B41/009 , C04B41/5127 , C04B41/88 , C23C4/08 , H01L21/4846 , H05K3/14 , C04B41/0063 , C04B41/4523 , C04B41/5353 , C04B35/08 , C04B35/10 , C04B35/48 , C04B35/581
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公开(公告)号:NO943647L
公开(公告)日:1994-09-30
申请号:NO943647
申请日:1994-09-30
Applicant: HOECHST AG
Inventor: KUHN HEINRICH , BOS ULRICH , HANNSS CARSTEN , KAYSER KARL-FRIEDRICH VON
Abstract: PCT No. PCT/EP93/00675 Sec. 371 Date Sep. 30, 1994 Sec. 102(e) Date Sep. 30, 1994 PCT Filed Mar. 19, 1993 PCT Pub. No. WO93/20255 PCT Pub. Date Oct. 14, 1993The invention relates to a process for producing a strong bond between copper layers, which have been applied by means of thermal spraying of pulverulent copper or copper alloys, and ceramic. Fine copper powder having a mean particle diameter of
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公开(公告)号:DE59308833D1
公开(公告)日:1998-09-03
申请号:DE59308833
申请日:1993-03-19
Applicant: HOECHST AG
Inventor: KUEHN HEINRICH , BOS ULRICH , HANNSS CARSTEN , VON KAYSER KARL-FRIEDRICH
Abstract: PCT No. PCT/EP93/00675 Sec. 371 Date Sep. 30, 1994 Sec. 102(e) Date Sep. 30, 1994 PCT Filed Mar. 19, 1993 PCT Pub. No. WO93/20255 PCT Pub. Date Oct. 14, 1993The invention relates to a process for producing a strong bond between copper layers, which have been applied by means of thermal spraying of pulverulent copper or copper alloys, and ceramic. Fine copper powder having a mean particle diameter of
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公开(公告)号:NO943647D0
公开(公告)日:1994-09-30
申请号:NO943647
申请日:1994-09-30
Applicant: HOECHST AG
Inventor: KUHN HEINRICH , BOS ULRICH , HANNSS CARSTEN , KAYSER KARL-FRIEDRICH VON
Abstract: PCT No. PCT/EP93/00675 Sec. 371 Date Sep. 30, 1994 Sec. 102(e) Date Sep. 30, 1994 PCT Filed Mar. 19, 1993 PCT Pub. No. WO93/20255 PCT Pub. Date Oct. 14, 1993The invention relates to a process for producing a strong bond between copper layers, which have been applied by means of thermal spraying of pulverulent copper or copper alloys, and ceramic. Fine copper powder having a mean particle diameter of
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