2.
    发明专利
    未知

    公开(公告)号:ES2121996T3

    公开(公告)日:1998-12-16

    申请号:ES93906570

    申请日:1993-03-19

    Applicant: HOECHST AG

    Abstract: PCT No. PCT/EP93/00675 Sec. 371 Date Sep. 30, 1994 Sec. 102(e) Date Sep. 30, 1994 PCT Filed Mar. 19, 1993 PCT Pub. No. WO93/20255 PCT Pub. Date Oct. 14, 1993The invention relates to a process for producing a strong bond between copper layers, which have been applied by means of thermal spraying of pulverulent copper or copper alloys, and ceramic. Fine copper powder having a mean particle diameter of

    4.
    发明专利
    未知

    公开(公告)号:NO943647L

    公开(公告)日:1994-09-30

    申请号:NO943647

    申请日:1994-09-30

    Applicant: HOECHST AG

    Abstract: PCT No. PCT/EP93/00675 Sec. 371 Date Sep. 30, 1994 Sec. 102(e) Date Sep. 30, 1994 PCT Filed Mar. 19, 1993 PCT Pub. No. WO93/20255 PCT Pub. Date Oct. 14, 1993The invention relates to a process for producing a strong bond between copper layers, which have been applied by means of thermal spraying of pulverulent copper or copper alloys, and ceramic. Fine copper powder having a mean particle diameter of

    5.
    发明专利
    未知

    公开(公告)号:DE59308833D1

    公开(公告)日:1998-09-03

    申请号:DE59308833

    申请日:1993-03-19

    Applicant: HOECHST AG

    Abstract: PCT No. PCT/EP93/00675 Sec. 371 Date Sep. 30, 1994 Sec. 102(e) Date Sep. 30, 1994 PCT Filed Mar. 19, 1993 PCT Pub. No. WO93/20255 PCT Pub. Date Oct. 14, 1993The invention relates to a process for producing a strong bond between copper layers, which have been applied by means of thermal spraying of pulverulent copper or copper alloys, and ceramic. Fine copper powder having a mean particle diameter of

    6.
    发明专利
    未知

    公开(公告)号:NO943647D0

    公开(公告)日:1994-09-30

    申请号:NO943647

    申请日:1994-09-30

    Applicant: HOECHST AG

    Abstract: PCT No. PCT/EP93/00675 Sec. 371 Date Sep. 30, 1994 Sec. 102(e) Date Sep. 30, 1994 PCT Filed Mar. 19, 1993 PCT Pub. No. WO93/20255 PCT Pub. Date Oct. 14, 1993The invention relates to a process for producing a strong bond between copper layers, which have been applied by means of thermal spraying of pulverulent copper or copper alloys, and ceramic. Fine copper powder having a mean particle diameter of

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