公开(公告)号：NO943647D0

公开(公告)日：1994-09-30

申请号：NO943647

申请日：1994-09-30

Applicant: HOECHST AG

Inventor： KUHN HEINRICH ,  BOS ULRICH ,  HANNSS CARSTEN ,  KAYSER KARL-FRIEDRICH VON

IPC: C04B41/51 ,  C04B41/88 ,  C23C4/08 ,  H01L21/48 ,  H05K3/14

Abstract: PCT No. PCT/EP93/00675 Sec. 371 Date Sep. 30, 1994 Sec. 102(e) Date Sep. 30, 1994 PCT Filed Mar. 19, 1993 PCT Pub. No. WO93/20255 PCT Pub. Date Oct. 14, 1993The invention relates to a process for producing a strong bond between copper layers, which have been applied by means of thermal spraying of pulverulent copper or copper alloys, and ceramic. Fine copper powder having a mean particle diameter of

公开(公告)号：CA670143A

公开(公告)日：1963-09-10

申请号：CA670143D

Applicant: HOECHST AG

Inventor： STEINMETZ ALFONS ,  GRAFEN KARLHEINZ ,  WETZEL WALTER ,  SCHERER OTTO ,  KUHN HEINRICH

公开(公告)号：CA542435A

公开(公告)日：1957-06-18

申请号：CA542435D

Applicant: HOECHST AG

Inventor： KUHN HEINRICH ,  SCHERER OTTO

公开(公告)号：CA806234A

公开(公告)日：1969-02-11

申请号：CA806234D

Applicant: HOECHST AG

Inventor： SCHERER OTTO ,  KUHN HEINRICH

公开(公告)号：CA650600A

公开(公告)日：1962-10-16

申请号：CA650600D

Applicant: HOECHST AG

Inventor： SCHERER OTTO ,  KUHN HEINRICH

公开(公告)号：CA601979A

公开(公告)日：1960-07-19

申请号：CA601979D

Applicant: HOECHST AG

Inventor： SCHERER OTTO ,  HAHN HELMUT ,  KUHN HEINRICH

公开(公告)号：ES2135884T3

公开(公告)日：1999-11-01

申请号：ES96908045

申请日：1996-03-15

Applicant: HOECHST AG

Inventor： KUHN HEINRICH ,  ESCHER CLAUS ,  LANDES KLAUS ,  HASLBECK PETER ,  GASCHLER OTFRIED ,  MULLER MARKUS

IPC: B05B7/22 ,  B22D23/00 ,  B41N1/00 ,  B41N3/03 ,  B41N7/04 ,  C23C4/00 ,  C23C4/02 ,  C23C4/10 ,  C23C4/12 ,  F24J2/48 ,  H05H1/42

Abstract: The invention concerns a method of coating a base with a plasma-sprayed layer with a spray powder contained in the molten state in the plasma. In the proposed process, the powder is introduced via powder feed ducts in the vicinity of the neutrode(s) or anode(s) or between the two into a channel of a plasma spray device, at least one arc being at least 20 mm in length at least some of the time and the base to be coated being a so-called continuous strip or large-surface unit of at least 0.005 m . The invention also concerns a device for coating a base, comprising a number of plasma spray devices and at least one noise-protection cabinet; the plasma spray devices each comprise at least one neutrode and at least one anode for producing an arc of at least 20 mm in length and for heating a spray powder. The spray powder is introduced in the vicinity of the anode(s) or neutrode(s) and/or between the two, and the device is provided with a device for micro-roughing the article in the form of a mechanical, physical or radiation micro-roughing unit.

公开(公告)号：ES2121996T3

公开(公告)日：1998-12-16

申请号：ES93906570

申请日：1993-03-19

Applicant: HOECHST AG

Inventor： KUHN HEINRICH ,  BOS ULRICH ,  HANNSS CARSTEN ,  VON KAYSER KARL-FRIEDRICH

IPC: C04B41/51 ,  C04B41/88 ,  C23C4/08 ,  H01L21/48 ,  H05K3/14

Abstract: PCT No. PCT/EP93/00675 Sec. 371 Date Sep. 30, 1994 Sec. 102(e) Date Sep. 30, 1994 PCT Filed Mar. 19, 1993 PCT Pub. No. WO93/20255 PCT Pub. Date Oct. 14, 1993The invention relates to a process for producing a strong bond between copper layers, which have been applied by means of thermal spraying of pulverulent copper or copper alloys, and ceramic. Fine copper powder having a mean particle diameter of

公开(公告)号：NO943647A

公开(公告)日：1994-09-30

申请号：NO943647

申请日：1994-09-30

Applicant: HOECHST AG

Inventor： KUHN HEINRICH ,  BOS ULRICH ,  HANNSS CARSTEN ,  KAYSER KARL-FRIEDRICH VON

IPC: C04B41/51 ,  C04B41/88 ,  C23C4/08 ,  H01L21/48 ,  H05K3/14

CPC classification number: C04B41/009 ,  C04B41/5127 ,  C04B41/88 ,  C23C4/08 ,  H01L21/4846 ,  H05K3/14 ,  C04B41/0063 ,  C04B41/4523 ,  C04B41/5353 ,  C04B35/08 ,  C04B35/10 ,  C04B35/48 ,  C04B35/581

公开(公告)号：CA652239A

公开(公告)日：1962-11-13

申请号：CA652239D

Applicant: HOECHST AG

Inventor： SCHERER OTTO ,  KUHN HEINRICH