Composite useful as insulation in electronics and thermal insulation

    公开(公告)号:DE19533565A1

    公开(公告)日:1997-03-13

    申请号:DE19533565

    申请日:1995-09-11

    Applicant: HOECHST AG

    Abstract: In a composite material contg. 10-97 vol.% aerogel particles and adhesive(s). The dia. of the aerogel particles is less than 0.5 mm. Also claimed is a method of making the composite. Pref. the adhesive is a phenol-, resorcinol-, urea- and/or melamine-HCHO resin. The aerogel is used in a fraction of 40-95 vol.% and has a particle dia. of less than 0.2 mm, esp. with bimodal distribution. It esp. is a SiO2 aerogel, more esp. with permanently hydrophobic gps. on the surface. Its porosity is more than 60% and density less than 0.6 g/cm . The composite may also contain fillers. The composite material has a density of less than 0.6 g/cm and thermal conductivity of less than 100 mW/m.K. It esp. has hydrophobic surface(s).

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