公开(公告)号：DE69307716T2

公开(公告)日：1997-06-12

申请号：DE69307716

申请日：1993-09-24

Applicant: HOECHST CELANESE CORP ,  IBM

Inventor： LU PING-HUNG ,  DAMMEL RALPH R ,  EIB NICHOLAS KISER ,  FICNER STANLEY A ,  KHANNA DINESH N ,  KLOFFENSTEIN THOMAS J ,  LYONS CHRISTOPHER F ,  PLAT MARINA ,  RAHMAN M DALIL

IPC: C08L61/04 ,  C08L61/06 ,  G03F7/023 ,  H01L21/027

Abstract: The present invention provides a photoresist composition containing a photosensitive component, a mixture of at least two novolak resins with a molecular weight distribution overlap of at least 50 % and having dissolution rates which differ by a factor of at least 2.0, and a suitable solvent and a method for producing such a photoresist. The present invention also provides semiconductor devices produced using such a photoresist composition and a method for producing such semiconductor devices.

公开(公告)号：DE69307716D1

公开(公告)日：1997-03-06

申请号：DE69307716

申请日：1993-09-24

Applicant: HOECHST CELANESE CORP ,  IBM

Inventor： LU PING-HUNG ,  DAMMEL RALPH R ,  EIB NICHOLAS KISER ,  FICNER STANLEY A ,  KHANNA DINESH N ,  KLOFFENSTEIN THOMAS J ,  LYONS CHRISTOPHER F ,  PLAT MARINA ,  RAHMAN M DALIL

IPC: C08L61/04 ,  C08L61/06 ,  G03F7/023 ,  H01L21/027

Abstract: The present invention provides a photoresist composition containing a photosensitive component, a mixture of at least two novolak resins with a molecular weight distribution overlap of at least 50 % and having dissolution rates which differ by a factor of at least 2.0, and a suitable solvent and a method for producing such a photoresist. The present invention also provides semiconductor devices produced using such a photoresist composition and a method for producing such semiconductor devices.

公开(公告)号：HK63397A

公开(公告)日：1997-05-23

申请号：HK63397

申请日：1997-05-15

Applicant: HOECHST CELANESE CORP ,  IBM

Inventor： LU PING-HUNG ,  DAMMEL RALPH R ,  EIB NICHOLAS KISER ,  FICNER STANLEY A ,  KHANNA DINESH N ,  KLOFFENSTEIN THOMAS J JR ,  LYONS CHRISTOPHER F ,  PLAT MARINA ,  RAHMAN M DALIL

IPC: C08L61/04 ,  C08L61/06 ,  G03F7/023 ,  H01L21/027

Abstract: The present invention provides a photoresist composition containing a photosensitive component, a mixture of at least two novolak resins with a molecular weight distribution overlap of at least 50 % and having dissolution rates which differ by a factor of at least 2.0, and a suitable solvent and a method for producing such a photoresist. The present invention also provides semiconductor devices produced using such a photoresist composition and a method for producing such semiconductor devices.

公开(公告)号：SG49669A1

公开(公告)日：1998-06-15

申请号：SG1996003602

申请日：1993-09-24

Applicant: HOECHST CELANESE CORP

Inventor： LU PING-HUNG ,  DAMMEL PALPH R ,  EIB NICHOLAS KISER ,  FICNER STANLEY A ,  KHANNA DINESH N ,  KLOFFENSTEIN THOMAS J JR ,  LYONS CHRISTOPHER F ,  PLAT MARINA ,  DALIL RAHMAN M

IPC: C08L61/04 ,  C08L61/06 ,  G03F7/023 ,  H01L21/027

Abstract: The present invention provides a photoresist composition containing a photosensitive component, a mixture of at least two novolak resins with a molecular weight distribution overlap of at least 50 % and having dissolution rates which differ by a factor of at least 2.0, and a suitable solvent and a method for producing such a photoresist. The present invention also provides semiconductor devices produced using such a photoresist composition and a method for producing such semiconductor devices.