公开(公告)号：WO1998029943A1

公开(公告)日：1998-07-09

申请号：PCT/US1997020639

申请日：1997-11-13

Applicant: HONEYWELL INC.

Inventor： HONEYWELL INC. ,  HERB, William, R. ,  BURNS, David, W. ,  YOUNGNER, Daniel, W.

IPC: H03H09/24

CPC classification number: B81B3/0072 ,  B81B2201/0271 ,  H03H9/02448 ,  H03H9/2463 ,  H03H9/2473

Abstract: A multi-material resonant thin film beam for a micromechanical sensor having a zero temperature coefficient of frequency (TCF) which is the resonant frequency shift with temperature change. One of the materials may be polysilicon and the other material may be silicon nitride or silicon oxide. Each material has a different thermal coefficient of expansion. The proportion of the various materials is adjusted and the specific geometries are determined so that the TCF is zero. One embodiment is a microbeam composed of two polysilicon thin films with a silicon nitride thin film inserted between the polysilicon films. The thickness of the silicon nitride film may be adjusted to trim the TCF to zero. The film of nitride instead may be placed on one side of a polysilicon film to form a beam. Dual or multiple beam resonators likewise may be made with several materials. The nitride may be placed in the shank areas which join and secure the ends of the beams. Such zero TCF beams may be incorporated in microsensor structures for measuring pressure, temperature, strain and other parameters.

Abstract translation: 一种用于微机械传感器的多材料谐振薄膜波束，其具有零温度频率系数（TCF），其是随着温度变化的谐振频率偏移。 其中一种材料可以是多晶硅，另一种材料可以是氮化硅或氧化硅。 每种材料具有不同的热膨胀系数。 调整各种材料的比例，确定特定几何形状，使得TCF为零。 一个实施例是由两个多晶硅薄膜组成的微束，其中氮化硅薄膜插入在多晶硅膜之间。 可以调节氮化硅膜的厚度以将TCF修整为零。 氮化物膜可以放置在多晶硅膜的一侧以形成光束。 双或多束谐振器同样可以由几种材料制成。 氮化物可以放置在连接并固定梁的端部的柄部区域中。 这种零TCF光束可以被并入用于测量压力，温度，应变和其它参数的微传感器结构中。

公开(公告)号：EP0950282A1

公开(公告)日：1999-10-20

申请号：EP97947478.0

申请日：1997-11-13

Applicant: HONEYWELL INC.

Inventor： HERB, William, R. ,  BURNS, David, W. ,  YOUNGNER, Daniel, W.

IPC: H03H9

CPC classification number: B81B3/0072 ,  B81B2201/0271 ,  H03H9/02448 ,  H03H9/2463 ,  H03H9/2473

Abstract: A multi-material resonant thin film beam for a micromechanical sensor having a zero temperature coefficient of frequency (TCF) which is the resonant frequency shift with temperature change. One of the materials may be polysilicon and the other material may be silicon nitride or silicon oxide. Each material has a different thermal coefficient of expansion. The proportion of the various materials is adjusted and the specific geometries are determined so that the TCF is zero. One embodiment is a microbeam composed of two polysilicon thin films with a silicon nitride thin film inserted between the polysilicon films. The thickness of the silicon nitride film may be adjusted to trim the TCF to zero. The film of nitride instead may be placed on one side of a polysilicon film to form a beam. Dual or multiple beam resonators likewise may be made with several materials. The nitride may be placed in the shank areas which join and secure the ends of the beams. Such zero TCF beams may be incorporated in microsensor structures for measuring pressure, temperature, strain and other parameters.

公开(公告)号：EP1042774B1

公开(公告)日：2003-03-05

申请号：EP98964707.8

申请日：1998-12-07

Applicant: Honeywell Inc.

Inventor： YOUNGNER, Daniel, W. ,  JOHNSON, Burgess, R.

IPC: H01H50/00

CPC classification number: H01H59/0009 ,  H01H1/66 ,  H01H9/42

Abstract: A relay device built using MEMS technology and having a semiconductor wafer base with a surface depression having a first electrically conductive surface pattern. A lower diaphragm is moveably positioned above the depression for contact and has a second electrically conductive surface pattern thereon. An upper diaphragm is positioned above the lower diaphragm, with a central electrode mounted between them to selectively attract and move a diaphragm upon application of voltage. A post connects the upper and lower diaphragms to move a diaphragm when the other is moved electrostatically. The diaphragms define a sealed region enclosing the central electrode. The surface patterns may be tapered at their perimeters to provide a contact contour allowing gradually increasing contact as the diaphragm moves toward the surface. The preferred wafer is a silicon wafer, and the diaphragms are polysilicon. The patterns are formed from highly conductive material like gold, while the outer regions are high resistive, chemically stable material like CrSiN. The sealed region is evacuated to have a vacuum, or may be filled with an inert gas. In a preferred embodiment, the sealed region is filled with a fluid having a measurable viscosity, and region is adapted to move the fluid upon electrostatic movement of the diaphragm, such that the viscosity of the fluid is selected to adjust the rate of movement of the diaphragm.

公开(公告)号：EP1042774A1

公开(公告)日：2000-10-11

申请号：EP98964707.8

申请日：1998-12-07

Applicant: Honeywell Inc.

Inventor： YOUNGNER, Daniel, W. ,  JOHNSON, Burgess, R.

IPC: H01H50/00

CPC classification number: H01H59/0009 ,  H01H1/66 ,  H01H9/42

Abstract: A relay device built using MEMS technology and having a semiconductor wafer base with a surface depression having a first electrically conductive surface pattern. A lower diaphragm is moveably positioned above the depression for contact and has a second electrically conductive surface pattern thereon. An upper diaphragm is positioned above the lower diaphragm, with a central electrode mounted between them to selectively attract and move a diaphragm upon application of voltage. A post connects the upper and lower diaphragms to move a diaphragm when the other is moved electrostatically. The diaphragms define a sealed region enclosing the central electrode. The surface patterns may be tapered at their perimeters to provide a contact contour allowing gradually increasing contact as the diaphragm moves toward the surface. The preferred wafer is a silicon wafer, and the diaphragms are polysilicon. The patterns are formed from highly conductive material like gold, while the outer regions are high resistive, chemically stable material like CrSiN. The sealed region is evacuated to have a vacuum, or may be filled with an inert gas. In a preferred embodiment, the sealed region is filled with a fluid having a measurable viscosity, and region is adapted to move the fluid upon electrostatic movement of the diaphragm, such that the viscosity of the fluid is selected to adjust the rate of movement of the diaphragm.

公开(公告)号：EP0950282B1

公开(公告)日：2001-06-27

申请号：EP97947478.0

申请日：1997-11-13

Applicant: HONEYWELL INC.

Inventor： HERB, William, R. ,  BURNS, David, W. ,  YOUNGNER, Daniel, W.

IPC: H03H9/24

CPC classification number: B81B3/0072 ,  B81B2201/0271 ,  H03H9/02448 ,  H03H9/2463 ,  H03H9/2473

公开(公告)号：EP1040326A2

公开(公告)日：2000-10-04

申请号：EP98967024.5

申请日：1998-11-19

Applicant: Honeywell Inc.

Inventor： FORD, Carol, M. ,  YOUNGNER, Daniel, W. ,  ZOOK, J., David

IPC: G01G19/00

CPC classification number: H01S3/083 ,  G01C19/661 ,  H01S3/038 ,  H01S3/0835

Abstract: An apparatus and method for prevention of migration of mobile ions in a gyroscope. A dielectric barrier material layer is placed between a gyroscope body and one or more gyroscope components. The dielectric barrier material layer reduces the electric field formed in the gyroscope block, and thus reduces ion migration therein. The material may prevent mobile ions from reaching the cathode seal.

公开(公告)号：EP0981725B1

公开(公告)日：2004-04-07

申请号：EP98960786.6

申请日：1998-12-07

Applicant: Honeywell Inc.

Inventor： YOUNGNER, Daniel, W.

IPC: G01L9/00 ,  G01L1/10

CPC classification number: G01P15/097 ,  G01L1/103 ,  G01L1/186 ,  G01L9/0011 ,  G01L9/002

Abstract: A very high temperature microbeam sensor of a resonant integrated microstructure having an electrostatic beam driver and an optical fiber pick-up for sensed light from the beam. The high temperature sensor has no components that are vulnerable to temperatures up to 600 degrees C. Associated components for detection, processing and driving are remote from the sensor environment. By using different materials in the beam assembly, such as tungsten for the beam, and sapphire for the substrate and the shell, the sensor can withstand temperatures up to 1000 degrees C. Also, optical fiber may be used for long distance connections between processing electronics and the driver in the sensing device, by locating a photo detector just outside the very or ultra high temperature sensing environment, and then using optical fiber for sending long distance signals from the processor to the driver photo detector, for eliminating electrical signal-to-noise problems.

公开(公告)号：EP1149393B1

公开(公告)日：2003-02-19

申请号：EP99966590.4

申请日：1999-12-21

Applicant: Honeywell Inc.

Inventor： YOUNGNER, Daniel, W. ,  RIDLEY, Jeffrey, A.

IPC: H01H1/00 ,  H01H36/00

CPC classification number: H01H36/00 ,  H01H1/0036 ,  H01H2036/0093

Abstract: A micromechanical switch (20) and a method for operating the micromechanical switch between an open position and a closed position by moving a magnet (50) between two positions. The magnet produces a magnetic flux that travels through a magnetically conductive layer (30,40,207,209). The magnetic flux within the magnetically conductive layer forcibly draws a contact element (60) into contact with an electrically conductive layer (27,28,29,221,223) and electrically shorts the open electrical contacts.

公开(公告)号：EP1149393A1

公开(公告)日：2001-10-31

申请号：EP99966590.4

申请日：1999-12-21

Applicant: Honeywell Inc.

Inventor： YOUNGNER, Daniel, W. ,  RIDLEY, Jeffrey, A.

IPC: H01H1/00 ,  H01H36/00

CPC classification number: H01H36/00 ,  H01H1/0036 ,  H01H2036/0093

Abstract: A micromechanical switch (20) and a method for operating the micromechanical switch between an open position and a closed position by moving a magnet (50) between two positions. The magnet produces a magnetic flux that travels through a magnetically conductive layer (30,40,207,209). The magnetic flux within the magnetically conductive layer forcibly draws a contact element (60) into contact with an electrically conductive layer (27,28,29,221,223) and electrically shorts the open electrical contacts.

公开(公告)号：EP0981725A1

公开(公告)日：2000-03-01

申请号：EP98960786.6

申请日：1998-12-07

Applicant: Honeywell Inc.

Inventor： YOUNGNER, Daniel, W.

IPC: G01L9/00 ,  G01L1/10

CPC classification number: G01P15/097 ,  G01L1/103 ,  G01L1/186 ,  G01L9/0011 ,  G01L9/002

Abstract: A very high temperature microbeam sensor of a resonant integrated microstructure having an electrostatic beam driver and an optical fiber pick-up for sensed light from the beam. The high temperature sensor has no components that are vulnerable to temperatures up to 600 degrees C. Associated components for detection, processing and driving are remote from the sensor environment. By using different materials in the beam assembly, such as tungsten for the beam, and sapphire for the substrate and the shell, the sensor can withstand temperatures up to 1000 degrees C. Also, optical fiber may be used for long distance connections between processing electronics and the driver in the sensing device, by locating a photo detector just outside the very or ultra high temperature sensing environment, and then using optical fiber for sending long distance signals from the processor to the driver photo detector, for eliminating electrical signal-to-noise problems.