公开(公告)号：WO0047025A3

公开(公告)日：2000-12-21

申请号：PCT/US0002731

申请日：2000-02-04

Applicant: HONEYWELL INT INC

Inventor： BIRON RICHARD M

IPC: H01R12/62 ,  H05K1/14 ,  H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H05K3/42

CPC classification number: H05K1/148 ,  H05K3/061 ,  H05K3/4092 ,  H05K3/427 ,  H05K3/4691 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2203/063

Abstract: A method for forming electrical interconnects (28) for printed circuit boards (32, 34) and the like includes the steps of laminating a first surface of a rigid dielectric substrate (10) with a first conductive laminate such that the first conductive laminate extends beyond at least one edge (35) of the dielectric substrate (10), patterning the first conductive laminate to define a plurality of electrical interconnects (28) which extend beyond the edge(s) (35) of the dielectric substrate (10), forming a plurality of conductive traces on a second surface of the dielectric substrate (10) and forming a plurality of openings in the dielectric substrate (10), each opening extending from a first location on the first surface of the dielectric (10) which is proximate at least one electrical interconnect to a second location on the second surface of the substrate (10) which is proximate at least one conductive trace. Conductive material is formed within the openings of the dielectric substrate (10) such that the conductive material facilitates electrical communication between the electrical interconnects (28) and the conductive traces. The electrical interconnects (28) may be formed so as to either provide electrical communication between a plurality of printed circuit boards (32, 34) or so as to define terminations for such printed circuits boards (32, 34).

Abstract translation: 用于形成用于印刷电路板（32,34）等的电互连（28）的方法包括以下步骤：将刚性电介质基板（10）的第一表面与第一导电层压体层压，使得第一导电层压板延伸超过 电介质基板（10）的至少一个边缘（35），图案化第一导电层压板以限定延伸超过电介质基板（10）的边缘（35）的多个电互连（28），形成 电介质基板（10）的第二表面上的多个导电迹线，并且在电介质基板（10）中形成多个开口，每个开口从电介质（10）的第一表面上的第一位置延伸，该第一位置是接近 至少一个电互连至位于所述衬底（10）的所述第二表面上的第二位置，其邻近至少一个导电迹线。 导电材料形成在电介质基板（10）的开口内，使得导电材料有助于电互连（28）和导电迹线之间的电连通。 电互连（28）可以形成为在多个印刷电路板（32,34）之间提供电连接，以便限定这种印刷电路板（32,34）的端接。