公开(公告)号：WO0204701A2

公开(公告)日：2002-01-17

申请号：PCT/US0121221

申请日：2001-07-05

Applicant: HONEYWELL INT INC

Inventor： KOSLOV ALEXANDER S ,  NARASIMHAN DAVE ,  PALANISAMY THIRUMALAI

IPC: C23C18/44 ,  C23C18/00

CPC classification number: C23C18/44 ,  Y10T428/12875

Abstract: This invention relates to electroless autocatalytic plating of platinum onto a substrate, an aqueous platinum plating bath, a process for plating a uniform coating of platinum onto various substrates using an electroless autocatalytic plating composition, and a platinum plated article formed therefrom. The plating bath of this invention allows direct autocatalytic plating of platinum on catalytically active and inactive, conductive and non-conductive substrates, avoiding the extra costs of activativing a catalytically inactive substrate.

Abstract translation: 本发明涉及铂在基板上的无电镀自动电镀，铂电镀浴，使用无电镀自动催化镀组合物将铂均匀涂布到各种基板上的方法，以及由其形成的镀铂制品。 本发明的电镀浴允许铂在催化活性和非活性，导电和非导电基材上的直接自催化电镀，避免了激活催化无活性底物的额外成本。

公开(公告)号：AU1877602A

公开(公告)日：2002-01-21

申请号：AU1877602

申请日：2001-07-05

Applicant: HONEYWELL INT INC

Inventor： KOSLOV ALEXANDER S ,  NARASIMHAN DAVE ,  PALANISAMY THIRUMALAI

IPC: C23C18/44 ,  C23C18/00

Abstract: This invention relates to electroless autocatalytic plating of platinum onto a substrate, an aqueous platinum plating bath, a process for plating a uniform coating of platinum onto various substrates using an electroless autocatalytic plating composition, and a platinum plated article formed therefrom. The plating bath of this invention allows direct autocatalytic plating of platinum on catalytically active and inactive, conductive and non-conductive substrates, avoiding the extra costs of activating a catalytically inactive substrate.