公开(公告)号：WO0204700A3

公开(公告)日：2003-01-09

申请号：PCT/US0121037

申请日：2001-07-05

Applicant: HONEYWELL INT INC

Inventor： KOZLOV ALEXANDER S ,  NARASIMHAN DAVE ,  PALANISAMY THIRUMALAI

IPC: C23C18/44

CPC classification number: C23C18/44 ,  Y10T428/12896

Abstract: This invention relates to electroless plating of silver onto a substrate, an aqueous silver plating bath, a process for plating a uniform coating of silver onto various substrates using an electroless plating composition, and a silver plated article formed therefrom. The plating bath neither contains nor generates toxic or flammable substances or substances thay may contaminate the silver coating. By avoiding strong complexing agents, virtually pure silver may be precipitated from the bath by simple boiling. Silver electroless autocatalytic plating bath consists of silver nitrate, ammonium hydroxide and hydrazine hydrate.

Abstract translation: 本发明涉及银在基材上的无电镀，银镀银水浴，使用化学镀组合物将银均匀涂覆在各种基材上的方法，以及由其形成的镀银制品。 镀浴既不含有也不会产生有毒或易燃物质或物质，可能会污染银涂层。 通过避免强的络合剂，通过简单的煮沸可以从浴中沉淀出几乎纯的银。 银无电解自动电镀浴由硝酸银，氢氧化铵和水合肼组成。

公开(公告)号：WO0204701A2

公开(公告)日：2002-01-17

申请号：PCT/US0121221

申请日：2001-07-05

Applicant: HONEYWELL INT INC

Inventor： KOSLOV ALEXANDER S ,  NARASIMHAN DAVE ,  PALANISAMY THIRUMALAI

IPC: C23C18/44 ,  C23C18/00

CPC classification number: C23C18/44 ,  Y10T428/12875

Abstract: This invention relates to electroless autocatalytic plating of platinum onto a substrate, an aqueous platinum plating bath, a process for plating a uniform coating of platinum onto various substrates using an electroless autocatalytic plating composition, and a platinum plated article formed therefrom. The plating bath of this invention allows direct autocatalytic plating of platinum on catalytically active and inactive, conductive and non-conductive substrates, avoiding the extra costs of activativing a catalytically inactive substrate.

Abstract translation: 本发明涉及铂在基板上的无电镀自动电镀，铂电镀浴，使用无电镀自动催化镀组合物将铂均匀涂布到各种基板上的方法，以及由其形成的镀铂制品。 本发明的电镀浴允许铂在催化活性和非活性，导电和非导电基材上的直接自催化电镀，避免了激活催化无活性底物的额外成本。

公开(公告)号：WO0204703A3

公开(公告)日：2002-07-18

申请号：PCT/US0121258

申请日：2001-07-05

Applicant: HONEYWELL INT INC

Inventor： KOZLOV ALEXANDER S ,  NARASIMHAN DAVE ,  PALANISAMY THIRUMALAI

IPC: C23C18/44 ,  H05K3/24

CPC classification number: C23C18/44 ,  H05K3/244 ,  Y10T428/12875

Abstract: An composition for electroless plating of rhodium onto a substrate, a process for plating a uniform coating of rhodium onto various substrates using an electroless plating composition, and a rhodium plated article formed therefrom. The plating composition is an aqueous solution of triamminetris(nitrito-N,N,N)rhodium(III); ammonium hydroxide; and hydrazine hydrate.

Abstract translation: 用于将铑化学镀在基材上的组合物，使用化学镀组合物将铑均匀涂覆到各种基材上的方法以及由其形成的镀铑制品。 电镀组合物是三氯铵（nitrito-N，N，N）铑（III）的水溶液; 氢氧化铵; 和水合肼。

公开(公告)号：WO0204702A2

公开(公告)日：2002-01-17

申请号：PCT/US0121257

申请日：2001-07-05

Applicant: HONEYWELL INT INC

Inventor： KOZLOV ALEXANDER S ,  NARASIMHAN DAVE ,  PALANISAMY THIRUMALAI

IPC: C23C18/44 ,  C23C18/48 ,  H05K3/24 ,  C23C18/00

CPC classification number: C23C18/48 ,  C23C18/44 ,  H05K3/244 ,  Y10T428/12861 ,  Y10T428/12875

Abstract: The present invention relates to electroless plating of a platinum-rhodium alloy onto a substrate: More particularly, this invention pertains to an aqueous platinum and rhodium plating bath, a process for plating a uniform coating of a platinum-rhodium alloy onto various substrates using an electroless plating composition, and a platinum-rhodium plated article formed therefrom. This process is suitable for the deposition of a platinum-rhodium alloy on virtually any material of any geometrical shape, including fibers and powders.

Abstract translation: 本发明涉及铂 - 铑合金在基片上的化学镀：更具体地说，本发明涉及铂和铑镀液浴，一种铂 - 铑合金均匀涂覆在各种基底上的方法，使用 化学镀组合物和由其形成的铂 - 铑镀制品。 该方法适用于几乎任何几何形状的材料（包括纤维和粉末）沉积铂 - 铑合金。

公开(公告)号：AU7685101A

公开(公告)日：2002-01-21

申请号：AU7685101

申请日：2001-07-05

Applicant: HONEYWELL INT INC

Inventor： KOZLOV ALEXANDER S ,  NARASIMHAN DAVE ,  PALANISAMY THIRUMALAI

IPC: C23C18/44 ,  C23C18/00

Abstract: This invention relates to electroless plating of silver onto a substrate, an aqueous silver plating bath, a process for plating a uniform coating of silver onto various substrates using an electroless plating composition, and a silver plated article formed therefrom. The plating bath neither contains nor generates toxic or flammable substances or substances that may contaminate the silver coating. By avoiding strong complexing agents, virtually pure silver may be precipitated from the bath by simple boiling. Silver electroless autocatalytic plating bath consists of silver nitrate, ammonium hydroxide and hydrazine hydrate.

公开(公告)号：CA2415781A1

公开(公告)日：2002-01-17

申请号：CA2415781

申请日：2001-07-05

Applicant: HONEYWELL INT INC

Inventor： PALANISAMY THIRUMALAI ,  NARASIMHAN DAVE ,  KOZLOV ALEXANDER S

IPC: C23C18/44 ,  H05K3/24

Abstract: An composition for electroless plating of rhodium onto a substrate, a proces s for plating a uniform coating of rhodium onto various substrates using an electroless plating composition, and a rhodium plated article formed therefrom. The plating composition is an aqueous solution of triamminetris(nitrito-N,N,N)rhodium(III); ammonium hydroxide; and hydrazine hydrate.

公开(公告)号：CA2415780A1

公开(公告)日：2002-01-17

申请号：CA2415780

申请日：2001-07-05

Applicant: HONEYWELL INT INC

Inventor： PALANISAMY THIRUMALAI ,  KOZLOV ALEXANDER S ,  NARASIMHAN DAVE

IPC: C23C18/44 ,  C23C18/48 ,  H05K3/24

Abstract: The present invention relates to electroless plating of a platinum-rhodium alloy onto a substrate: More particularly, this invention pertains to an aqueous platinum and rhodium plating bath, a process for plating a uniform coating of a platinum-rhodium alloy onto various substrates using an electroless plating composition, and a platinum-rhodium plated article forme d therefrom. This process is suitable for the deposition of a platinum-rhodium alloy on virtually any material of any geometrical shape, including fibers a nd powders.

公开(公告)号：DE602006021437D1

公开(公告)日：2011-06-01

申请号：DE602006021437

申请日：2006-08-28

Applicant: HONEYWELL INT INC

Inventor： SIEGGEL ALFRED ,  NERENZ FRANK ,  PALANISAMY THIRUMALAI ,  POSS ANDREW ,  DEMEL SONJA

IPC: C07D487/10 ,  C07D471/10 ,  C07D471/20 ,  C07D487/20 ,  C07D498/10

公开(公告)号：AT506366T

公开(公告)日：2011-05-15

申请号：AT06790055

申请日：2006-08-28

Applicant: HONEYWELL INT INC

Inventor： SIEGGEL ALFRED ,  NERENZ FRANK ,  PALANISAMY THIRUMALAI ,  POSS ANDREW ,  DEMEL SONJA

IPC: C07D487/10 ,  C07D471/10 ,  C07D471/20 ,  C07D487/20 ,  C07D498/10

Abstract: A method for preparing a spiro quaternary ammonium system and electrolytes containing spiro quaternary ammonium cations, comprising a synthesizing step wherein a spiro ammonium system is formed in a medium that can serve as both the reaction solvent and as an electrolyte solvent. A one-solution method of making a non-aqueous electrolyte composition that comprises at least one of a spiro quaternary ammonium compound of the following formula:

公开(公告)号：AT269912T

公开(公告)日：2004-07-15

申请号：AT01953413

申请日：2001-07-05

Applicant: HONEYWELL INT INC

Inventor： KOZLOV ALEXANDER S ,  NARASIMHAN DAVE ,  PALANISAMY THIRUMALAI

IPC: C23C18/44 ,  C23C18/48 ,  H05K3/24

Abstract: The present invention relates to electroless plating of a platinum-rhodium alloy onto a substrate. More particularly, this invention pertains to an aqueous platinum and rhodium plating bath, a process for plating a uniform coating of a platinum-rhodium alloy onto various substrates using an electroless plating composition, and a platinum-rhodium plated article formed therefrom. This process is suitable for the deposition of a platinum-rhodium alloy on virtually any material of any geometrical shape, including fibers and powders.