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    NOVEL MANUFACTURING DESIGN AND PROCESSING METHODS AND APPARATUS FOR SPUTTERING TARGETS
    1.
    发明申请
    NOVEL MANUFACTURING DESIGN AND PROCESSING METHODS AND APPARATUS FOR SPUTTERING TARGETS 审中-公开
    新型制造设计与处理方法及设备用于溅射目标

    公开(公告)号：WO2008060917A2

    公开(公告)日：2008-05-22

    申请号：PCT/US2007/083903

    申请日：2007-11-07

    Applicant: HONEYWELL INTERNATIONAL INC. ,  KARDOKUS, Janine ,  WERNER, Hort ,  STROTHERS, Susan D. ,  HAUSMAN, Christie J. ,  HUBERT, Kevin T. ,  MORALES, Diane ,  PAYTON, Michael D.

    Inventor： KARDOKUS, Janine ,  WERNER, Hort ,  STROTHERS, Susan D. ,  HAUSMAN, Christie J. ,  HUBERT, Kevin T. ,  MORALES, Diane ,  PAYTON, Michael D.

    IPC: C23C14/34

    CPC classification number: C23C14/3414

    Abstract: Sputtering targets having reduced burn-in times are described herein that include: a) a machine-finished surface material having an average grain size, and b) a core material having an average grain size, wherein the machine-finished surface material has an average surface roughness (Ra) equal to or less than about the average grain size of at least one of the surface material or the core material. Sputtering targets having reduced burn-in times are described herein that include: a surface material, and a core material, wherein at least one of the surface material or the core material comprises a relatively band-free crystallographic orientation. In addition, methods of producing sputtering targets having reduced burn-in times include: providing a surface material having at least some residual surface damage, providing a core material, coupling the surface material to the core material, and machine-finishing the surface material to an average surface roughness (Ra) equal to or less than about the average grain size of at least one of the surface material or the core material. Also, methods of producing sputtering targets having reduced burn-in times include: providing a surface material combined with a core material, wherein the surface material has at least some residual surface damage and machine-finishing the surface material to an average surface roughness (Ra) equal to or less than about the average grain size of at least one of the surface material or the core material.

    Abstract translation: 本文描述了具有减少的老化时间的溅射靶，其包括：a）具有平均晶粒尺寸的机加工的表面材料，以及b）具有平均晶粒尺寸的芯材，其中机加工表面材料具有平均 表面粗糙度（Ra）等于或小于表面材料或芯材中至少一种的平均晶粒尺寸。 本文描述了具有减少的老化时间的溅射靶，其包括：表面材料和芯材料，其中至少一个表面材料或芯材料包含相对无带的结晶取向。 此外，生产具有减少的老化时间的溅射靶的方法包括：提供具有至少一些残余表面损伤的表面材料，提供芯材料，将表面材料耦合到芯材料，以及将表面材料机加工成 平均表面粗糙度（Ra）等于或小于表面材料或芯材中至少一种的平均晶粒尺寸。 此外，生产具有减少的烧成时间的溅射靶的方法包括：提供与芯材组合的表面材料，其中表面材料具有至少一些残余表面损伤并将表面材料机加工成平均表面粗糙度（Ra ）等于或小于表面材料或芯材料中的至少一种的平均晶粒尺寸。

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