Method of manufacturing photomask, pattern transfer method, processing device for photomask substate , and thin film patterning method
    1.
    发明公开
    Method of manufacturing photomask, pattern transfer method, processing device for photomask substate , and thin film patterning method 有权
    光刻胶的制造方法,图案转印方法,光电子显微镜处理装置,薄膜​​图案方法

    公开(公告)号:KR20100081937A

    公开(公告)日:2010-07-15

    申请号:KR20100000415

    申请日:2010-01-05

    Applicant: HOYA CORP

    Inventor: AIZAWA TAKASHI

    CPC classification number: G03F1/76 G03F1/54 G03F1/80 G03F7/0382

    Abstract: PURPOSE: A method for manufacturing a photo-mask, a method for transferring a pattern, an apparatus for processing a photo-mask substrate, and a method for pattering a thin film are provided to transfer a photo-mask pattern by eliminating the effect of an exposure process which is generated by unnecessary energy applied to a resist. CONSTITUTION: A thin film(2) and a resist film(3) are formed on a substrate in order to form a photo-mask blank. A transferring pattern(4) is patterned on the resist film of the photo-mask blank. A surface treatment is implemented on the surface of the resist film by contacting with an oxide. A resist pattern(3a) is formed by developing the resist film. The thin film is etched using the resist pattern as a mask.

    Abstract translation: 目的:制造光掩模的方法,转印图案的方法,用于处理光掩模基板的装置和用于图案化薄膜的方法,以通过消除光掩模图案的影响来转移光掩模图案 由不必要的能量施加到抗蚀剂产生的曝光过程。 构成:在基板上形成薄膜(2)和抗蚀剂膜(3),以形成光掩模坯料。 在光掩模板的抗蚀膜上形成转印图案(4)。 通过与氧化物接触,在抗蚀剂膜的表面上进行表面处理。 通过显影抗蚀剂膜形成抗蚀剂图案(3a)。 使用抗蚀剂图案作为掩模蚀刻薄膜。

Patent Agency Ranking