Abstract:
PROBLEM TO BE SOLVED: To provide a mask blank which has high uniformity of the composition and optical characteristics in the plane and the film thickness direction of a phase shift film, even when a silicon based material is used in forming the phase shift film, and high uniformity of the composition and optical characteristics of phase shift films among a plurality of substrates and is low-defect.SOLUTION: In a mask blank, a phase shift film which transmits ArF exposure light with a specified transmissivity and causes a phase shift of a specified amount in the transmitted ArF exposure light is formed on a translucent substrate. The phase shift film includes a structure in which a low-transmission layer and a high-transmission layer are laminated together. The low- and high-transmission layers are composed of a silicon- or nitrogen-based material which may contain one or more elements selected from metalloid and non-metallic elements and rare gases, and the low-transmission layer is lower in nitrogen content than the high-transmission layer.
Abstract:
PROBLEM TO BE SOLVED: To provide a mask blank that is optimally applicable to modification of an EB defect, and enables a light shield film to be made thinner.SOLUTION: The mask blank including a thin film for forming a transfer pattern on a translucent substrate consists of at least a two-layer structure made of an under layer and an upper layer. The thin film is composed of a material that contains a transition metal and silicon, and further at least one element or more selected from oxygen and nitrogen. In the upper layer, a total content of the nitrogen and the oxygen in a layer is 30 atom% or more, and a content of the transition metal is 10 atom% or less, and a ratio of a content of the transition metal divided by a total content of the transition metal and the silicon is 4% or more. In the under layer, a sheet resistance value is 3 kΩ/sq. or less.
Abstract:
PROBLEM TO BE SOLVED: To provide a photo-mask blank capable of forming an extremely minute pattern, and to provide a photo-mask with a minute pattern formed on the photo-mask blank.SOLUTION: A photo-mask blank comprises a thin film consisting of at least two layers on a transparent substrate. The thin film comprises: a first layer consisting of material containing tantalum, nitrogen, and xenon; and a second layer consisting of material containing tantalum, oxygen and argon laminated on an upper surface of the first layer.
Abstract:
PROBLEM TO BE SOLVED: To form a film with a more uniform film thickness than conventional one in a method for forming a film by sputtering.SOLUTION: In the method for forming a thin film on a film formation target surface of a substrate by sputtering, a sputtering target is an ingot made of a material containing metal and rolled in an uniaxial rolling direction, and the thin film is formed while the substrate is rotated around a rotation axis passing the center of the film formation target surface. A sputter surface of the sputtering target is disposed so as to face the film formation target surface of the substrate and have a prescribed angle to the film formation target surface, and the rotation axis of the substrate and a line passing the center of the sputter surface and being parallel with the rotation axis of the substrate are shifted from each other, and the sputtering target is disposed so that the rolling direction is substantially vertical to a plane parallel with both the rotation axis of the substrate and a plane vertical to the sputter surface.
Abstract:
PROBLEM TO BE SOLVED: To provide a mask blank which largely reduces various loads relating to manufacture of a transfer mask by a light-shielding film with a reduced EMF bias and can satisfy a condition that the light-shielding film ensures a sufficient optical density, and to provide a transfer mask.SOLUTION: A mask blank is used to manufacture a binary mask adapted to be applied with ArF excimer laser exposure light and comprises, on a transparent substrate, a light-shielding film for forming a transfer pattern. The light-shielding film has a laminated structure of a light-shielding layer and a surface antireflection layer and has an optical density of 2.8 or more for the exposure light and a thickness of 45 nm or less, and the light-shielding layer is made of a material having a total content of transition metal and silicon of 90 atom% or more and has a thickness of 30 nm or more, and the surface antireflection layer has a thickness of 3 nm or more and 6 nm or less, and a phase difference between the exposure light transmitted through the light-shielding film and the exposure light transmitted in air for a distance equal to the thickness of the light-shielding film is 30° or less.
Abstract:
PROBLEM TO BE SOLVED: To provide a mask blank which can form a minute mold pattern with high pattern accuracy in manufacturing an imprint mold.SOLUTION: A mask blank 10 has a translucent substrate 1 and a thin film 2 formed so as to be in contact with a surface of the substrate. The thin film 2 is made of a laminated film including an upper layer 4 made of a material containing Si or a material containing Ta, and a lower layer 3 made of a material containing at least one of Hf and Zr and substantially not containing oxygen.
Abstract:
PROBLEM TO BE SOLVED: To provide a reflective mask blank substrate having high surface smoothness that increases the reflectance against exposure light, and having little defects, to provide a high-quality reflective mask blank having little defects and increased reflectance of a multilayered reflecting film against exposure light, and to provide a high-quality reflective mask having no pattern defect caused by a surface defect on a reflecting surface of the mask and showing excellent pattern transfer property. SOLUTION: The reflective mask blank substrate is obtained by polishing the principal surface of a light-transmitting substrate essentially comprising glass to a predetermined surface roughness and then subjecting the substrate to ion beam irradiation while the substrate is placed to allow the ion beam to be incident to the principal surface of the substrate at an incident angle of 20° or more and less than 90° and the substrate is rotated. The reflective mask blank is obtained by depositing a multilayered reflecting film and an absorbent film on the reflective mask blank substrate. The absorbent film of the reflective mask blank is patterned to obtain the reflective mask. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a halftone phase shifting mask capable of transferring a high-precision transfer pattern. SOLUTION: In a halftone phase shifting mask blank 1 having on a transparent substrate a halftone phase shifter film for forming a halftone phase shifter portion, the halftone phase shifter film 5 comprises an upper layer 4 comprising a material consisting essentially of silicon, oxygen and nitrogen and a lower layer 3 comprising a material consisting essentially of tantalum and hafnium. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To increase the coercive force and the product of residual magnetization and film thickness of a magnetic recording medium, to decrease changes with time, and to decrease the medium noise during recording and reproducing. SOLUTION: A base coating layer 2 containing Cr and Mo is formed on a glass substrate (nonmagnetic substrate) 1, and a magnetic layer 3 containing Co and Pt is formed on the base coating layer. Further, Mo may be added to the magnetic layer 3, and if necessary, other additive elements are added to the base coating layer and the magnetic layer. If necessary, a protective layer 4 and a lubricating layer 5 are successively formed on the magnetic layer.
Abstract:
PROBLEM TO BE SOLVED: To obtain a magnetic recording medium having a difference in the spacings between crystal lattice faces of a specific range by regulating the forming conditions for a nonmagnetic ground surface layer consisting essentially of Cr and V and a CoPt-base magnetic layer. SOLUTION: The nonmagnetic ground surface layer of the magnetic recording medium having the nonmagnetic ground surface layer and CoPt-base magnetic layer in this order on a substrate consists of the layers of >=1 layer and the nonmagnetic ground surface layer in contact with the CoPt-base magnetic layer consists of material consisting essentially of the Cr and V. The difference (d(002) -d(110) ) obtd. by subtracting the spacing between the crystal lattice faces of the bcc(110) face of the nonmagnetic ground surface layer consisting of the material consisting essentially of the Cr and V from the spacing between the crystal lattice faces of the hcp(002) face of the magnetic layer is set within a range of 0.002 to 0.032 Angstrom. The Co content of the CoPt-base magnetic layer preferably exists in a range of 70 to 80 at.%, the Pt content thereof 5 to 15 at.%, the Cr content thereof 5 to 25 at.%, and the Ta content thereof 1 to 7 at.%.