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公开(公告)号：PH12012000258A1
公开(公告)日：2015-06-01
申请号：PH12012000258
申请日：2012-09-07
Applicant: HOYA CORP
Inventor： IMAI MITSUGU , HASHIMOTO KAZUAKI , SUGIHARA OSAMU
Abstract: An ion-exchanged glass article manufacturing method includes an ion-exchange step of bringing a glass article with a composition containing Li into contact with a molten salt dissolved solution containing an alkali metal element having an ionic radius larger than an ionic radius of the Li contained in the glass article, thereby ion-exchanging the Li in the glass article with the alkali metal element in the molten salt dissolved solution. At least one kind of additive selected from the group consisting of NaF, KF, K3AlF6, Na2CO3, NaHCO3, K2CO3, KHCO3, Na2SO4, K2SO4, KAI(SO4)2, Na3PO4, and K3PO4 is added to the molten salt dissolved solution so that the ion-exchange step is carried out while the additive is in a solid state.
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2.发明专利Filter, method for manufacturing membrane ring with bump and full wafer contact board 审中-公开过滤器，用于制造具有保险丝和全波形接触板的膜圈的方法
公开(公告)号：JP2010255027A
公开(公告)日：2010-11-11
申请号：JP2009104175
申请日：2009-04-22
Inventor： SUGIHARA OSAMU
Abstract: PROBLEM TO BE SOLVED: To provide a method for forming minute nickel bumps having a uniform size when a large number of minute nickel bumps of several tens of μm size in a membrane ring with bumps are formed by electroplating.
SOLUTION: A plate-shaped filter 17 composed of an inorganic porous body, formed by sintering fine particles of soda lime glass and having micropores having ≤0.5 μm pore diameter is provided in a treatment tank 11 so as to be parallel to a membrane ring of a cathode 13 and electroplating is performed. Thereby, diffusion of slime composed of a nickel particle having a nearly sub micron size to the cathode 13 side can be satisfactorily prevented and uniform nickel bumps 26 can be formed.
COPYRIGHT: (C)2011,JPO&INPITAbstract translation: 要解决的问题：提供一种形成具有均匀尺寸的微小镍凸块的方法，当通过电镀形成具有凸起的膜环中具有数十μm尺寸的大量微小镍凸块时。 解决方案：一个由无机多孔体构成的板状过滤器17，其通过烧结钠钙玻璃细颗粒并具有孔径小于0.5微米的微孔而形成，在处理槽11中设置成平行于 进行阴极13的膜环和电镀。 由此，可以令人满意地防止由具有接近亚微米尺寸的镍颗粒构成的粘液向阴极13侧的扩散，并可形成均匀的镍凸块26。 版权所有（C）2011，JPO＆INPIT
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3.发明专利Method of manufacturing membrane ring with bump and wafer batch contact board 审中-公开制造带隔离膜和隔板的接触板的方法
公开(公告)号：JP2010219391A
公开(公告)日：2010-09-30
申请号：JP2009065945
申请日：2009-03-18
Inventor： SUGIHARA OSAMU
Abstract: PROBLEM TO BE SOLVED: To improve an yield by improving the positional precision of a bump in a membrane ring with the bump.
SOLUTION: On an aluminum plate 13 warmed at 100°C, a laminate film 28 comprised of copper foil and a polyimide film is formed while bringing a copper foil side into contact with the aluminum plate 13 and a rigid ring 23 coated with a thermosetting adhesive and comprised of SiC and a ring-shaped SUS weight stone 14 (whose weight is about 2.5 kg) are sequentially installed thereon. The laminate film 28, the ring 23 and the weight stone 14 are then warmed while being left for about five minutes until a temperature reaches 100°C. Next, temperatures of the laminate film 28, the ring 23 and the weight stone 14 are elevated up to 120°C gradually for about five minutes by a heater controlled by a temperature adjusting means. They are finally left at 120°C for 45 minutes to harden the thermosetting adhesive, thereby adhering the laminate film 28 and the ring 23.
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 要解决的问题：通过提高具有凸块的膜环中的凸块的位置精度来提高产量。 解决方案：在加热到100℃的铝板13上，形成由铜箔和聚酰亚胺膜构成的层压膜28，同时使铜箔与铝板13接触，并将刚性环23涂覆 由SiC和环状SUS重石14（重量约2.5kg）组成的热固性粘合剂依次安装在其上。 然后将层压膜28，环23和重块石14加热，同时放置约五分钟直到温度达到100℃。 接下来，通过由温度调节装置控制的加热器将层压膜28，环23和重物块14的温度逐渐升高至120℃约5分钟。 最终在120℃下放置45分钟以硬化热固性粘合剂，从而粘合层合薄膜28和环23.版权所有（C）2010，JPO＆INPIT
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4.发明专利Regenerating method of glass substrate for mask blank, method for manufacturing mask blank, and method for manufacturing transfer mask 有权用于掩模布的玻璃基板的再生方法，制造掩模层的方法以及制造转印掩模的方法
公开(公告)号：JP2010020339A
公开(公告)日：2010-01-28
申请号：JP2009230209
申请日：2009-10-02
Inventor： SUZUKI HISAYUKI , SUGIHARA OSAMU
Abstract: PROBLEM TO BE SOLVED: To favorably regenerate a glass substrate for a mask blank by reliably stripping a thin film while suppressing the glass substrate from roughening, when a thin film containing metal, silicon and nitrogen is stripped with a stripping liquid. SOLUTION: The glass substrate for a mask blank having a thin film essentially comprising the metal, the silicon and the nitrogen formed on a glass substrate is regenerated by stripping the thin film by bringing the thin film into contact with an aqueous solution containing at least one kind of fluorine compound selected from hydrofluoric acid, hydrosilicofluoric acid, ammonium hydrogenfluoride, and at least one kind of oxidizing agent selected from hydrogen peroxide, nitric acid and sulfuric acid, and containing the fluorine compound by 0.1 to 0.8 wt.%. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：为了通过在抑制玻璃基板粗糙化的同时可靠地剥离薄膜来有利地再生用于掩模坯料的玻璃基板，当用剥离液体剥离含有金属，硅和氮的薄膜时。 解决方案：通过使薄膜与含有以下物质的水溶液接触来剥离薄膜，该薄膜基本上包含形成在玻璃基板上的金属，硅和氮的掩模坯料用玻璃基板， 选自氢氟酸，氢硅氟酸，氢氟酸铵中的至少一种氟化合物和选自过氧化氢，硝酸和硫酸的至少一种氧化剂，并且含氟化合物的含量为0.1-0.8重量％。 版权所有（C）2010，JPO＆INPIT
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5.发明专利Etching liquid, etching method, and method for producing counter substrate for liquid crystal display panel 有权蚀刻液体，蚀刻方法和用于生产液晶显示面板的计数器基板的方法
公开(公告)号：JP2008081832A
公开(公告)日：2008-04-10
申请号：JP2006266618
申请日：2006-09-29
Inventor： SUGIHARA OSAMU , KANAZAWA KAZUFUMI
IPC: C23F1/20 , G02F1/1368
Abstract: PROBLEM TO BE SOLVED: To provide an etching liquid and an etching method suitable for the wet etching of an aluminum-containing material, and to provide a method for producing a counter substrate or the like. SOLUTION: The etching liquid for an aluminum-containing material is composed of a solution containing ammonium hydrogen fluoride, hydrogen peroxide and water. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation: 要解决的问题：提供一种适用于含铝材料的湿法蚀刻的蚀刻液和蚀刻方法，并提供制造相对基板等的方法。 解决方案：含铝材料的蚀刻液由含有氟化氢铵，过氧化氢和水的溶液组成。 版权所有（C）2008，JPO＆INPIT
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Patent Agency Ranking6.发明专利Membrane ring with bump and its manufacturing method, and contact board and its manufacturing method 有权带有保护膜及其制造方法，接触板及其制造方法
公开(公告)号：JP2006253254A
公开(公告)日：2006-09-21
申请号：JP2005064916
申请日：2005-03-09
Inventor： SAWADA HIDEKI , SUGIHARA OSAMU
Abstract: PROBLEM TO BE SOLVED: To accurately align an anisotropic conductive rubber sheet and a membrane ring with a bump with each other. SOLUTION: The membrane with a bump comprises a membrane 20 wherein a hole 24 is formed for alignment whose relative position is already known with respect to a bump hole, an isolated pad to be brought into contact with the anisotropic conductive rubber sheet, a pad 28 for alignment whose relative position with respect to the isolated pad is already known, and a bump to be brought into contact with a semiconductor device. The hole 24 for alignment and the pad 28 for alignment are aligned with respect to an alignment 44 formed in the anisotropic conductive rubber sheet. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：使各向异性导电橡胶片和具有凸起的膜环彼此精确对准。 解决方案：具有凸块的膜包括膜20，其中形成用于对准的孔24，其相对于凸起孔相对位置已知，与各向异性导电橡胶片接触的隔离垫， 用于对准的垫28，其相对于隔离垫的相对位置是已知的，以及与半导体器件接触的凸块。 用于对准的孔24和用于对准的焊盘28相对于形成在各向异性导电橡胶片中的对准44对准。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2004125782A
公开(公告)日：2004-04-22
申请号：JP2003206066
申请日：2003-08-05
Inventor： SUGIHARA OSAMU
Abstract: PROBLEM TO BE SOLVED: To enhance durability by controlling the hardness and separation resistance of a probe contact. SOLUTION: This contact component has a probe contact for contacting a part to be contacted which is formed by plating method. The probe contact (bump contact 2) of the contact component is made from a polycrystalline material with a crystal grain size of not less than 10 nm nor more than 40 nm. Thus, by adjusting the crystal grain size of the probe contact and the amount of carbon contained in the probe contact, the hardness and the separation resistance of the probe contact can be controlled. As a result, the contact component with the probe contact excellent in durability can be obtained. COPYRIGHT: (C)2004,JPO
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公开(公告)号：JP2003043066A
公开(公告)日：2003-02-13
申请号：JP2001226254
申请日：2001-07-26
Inventor： SUGIHARA OSAMU , SUZUKI NOBUHIKO
Abstract: PROBLEM TO BE SOLVED: To provide a contact probe member and the like resolving the problem of a reflection at the end of a transmission line.
SOLUTION: The contact probe member at least has a plurality of electrodes provided on an insulation board corresponding to each pad in a semiconductor device and a plurality of transmission lines provided on the insulation board and electrically connected to a plurality of electrodes. The contact probe member is characterized in that, for preventing the reflection from the end of the transmission lines, the contact probe member is provided with a termination resistor 80 at the end (a) of a transmission line.
COPYRIGHT: (C)2003,JPOAbstract translation: 要解决的问题：提供一种接触探针构件等，以解决传输线末端的反射问题。 解决方案：接触探针构件至少具有设置在与半导体器件中的每个焊盘相对应的绝缘板上的多个电极和设置在绝缘板上并电连接到多个电极的多个传输线。 接触探针构件的特征在于，为了防止传输线的端部的反射，接触探针构件在传输线的端部（a）处设置有终端电阻器80。
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公开(公告)号：JP2002076074A
公开(公告)日：2002-03-15
申请号：JP2000267553
申请日：2000-09-04
Applicant: HOYA CORP
Inventor： SUGIHARA OSAMU , MASUDA KENICHI
Abstract: PROBLEM TO BE SOLVED: To provide a contact component for a wafer batch contact board on which the positioning accuracy of isolation pads and isolation bumps is improved, and manufacturing method, etc., of the same. SOLUTION: In a wafer batch contact board used for tests of many semiconductor devices formed on a wafer by a batch test system, in order to reduce the expansion of insulation film 32 in the contact area due to ring 31, remaining pattern 35 is formed on the front surface and/or rear surface of insulation film 32 for avoiding isolation pads 34 and/or isolation bumps 33 so that the positioning shift is limited within 5 ppm%.
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公开(公告)号：JP2002033358A
公开(公告)日：2002-01-31
申请号：JP2000215070
申请日：2000-07-14
Applicant: HOYA CORP
Inventor： SUGIHARA OSAMU
Abstract: PROBLEM TO BE SOLVED: To provide a wafer in-batch contact board together with its manufacturing method and the like, of noise-proof against high frequency, with improved high-frequency characteristics. SOLUTION: A wafer in-batch contact board is provided which is used for collectively testing semiconductor devices formed in multiple numbers on a wafer. Here, a GND wiring or a power-source wiring (GND pad 12c or power- source pad 12a) on a multilayer wiring board 10 is connected to a metal frame 22, supporting an anisotropic conductive rubber 21. To conductive patterns 35' and 35 on the surface of an insulating film 32 of a contact part 30, the GND wiring or the power-source wiring (GND pad 12c or power-source pad 12a) on the multilayer wiring board 10 is connected.
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