Mask blank, mask for transfer, method for manufacturing a mask blank, method for manufacturing a mask for transfer, and method for manufacturing a semiconductor device
    2.
    发明专利
    Mask blank, mask for transfer, method for manufacturing a mask blank, method for manufacturing a mask for transfer, and method for manufacturing a semiconductor device 有权
    掩模板,转印掩模,制造掩模板的方法,用于制造用于传送的掩模的方法以及用于制造半导体器件的方法

    公开(公告)号:JP2014145920A

    公开(公告)日:2014-08-14

    申请号:JP2013014503

    申请日:2013-01-29

    Abstract: PROBLEM TO BE SOLVED: To provide a mask blank capable of abating the electromagnetic field (EMF) bias without suppressing the phase difference of a thin film and a mask for transfer obtained by processing this thin film.SOLUTION: In a mask blank 1 including a translucent substrate 11 and a thin film 21 configured atop the translucent substrate 11, the thin film 21 possesses, in proper order from the translucent substrate 11 side, a lower layer 13a and an upper layer 13b possessing an interface S bordering the lower layer 13a and configured adjacently to the lower layer 13a. The lower layer 13a includes not only a transition metal and silicon but also at least either of nitrogen and oxygen, whereas variations of contents of the respective elements included within the lower layer 13a along the film thickness direction thereof are 10 atom% or below. The refractive index nb of the upper layer 13b is lower than the refractive index na of the lower layer 13a, whereas the extinction coefficient kb of the same is lower than the extinction coefficient ka of the lower layer 13a.

    Abstract translation: 要解决的问题:提供一种能够抑制电磁场(EMF)偏压而不抑制薄膜的相位差的掩模板和通过处理该薄膜获得的转印掩模。解决方案:在包括 半透明基板11和配置在透光性基板11的上方的薄膜21,薄膜21从透光性基板11侧顺次具有下层13a和上层13b,上层13a和下层13b具有与下层13a和 配置成与下层13a相邻。 下层13a不仅包括过渡金属和硅,而且还包括氮和氧中的至少一种,而沿着膜厚度方向包含在下层13a内的各元素的含量变化为10原子%以下。 上层13b的折射率nb低于下层13a的折射率na,而其消光系数kb低于下层13a的消光系数ka。

    マスクブランクの製造方法及び転写用マスクの製造方法
    3.
    发明专利
    マスクブランクの製造方法及び転写用マスクの製造方法 有权
    生产掩模棉的方法,以及生产转移掩模的方法

    公开(公告)号:JP2015040969A

    公开(公告)日:2015-03-02

    申请号:JP2013171654

    申请日:2013-08-21

    Abstract: 【課題】スパッタリング法で成膜された薄膜の状態を正確に管理し、品質の安定したマスクブランクの製造方法を提供する。【解決手段】枚葉式スパッタリング装置を用いてスパッタリング法で、基板上に転写パターンを形成するための薄膜を形成してマスクブランクを製造する。上記スパッタリング装置内で基板上に前記薄膜を成膜した後、そのスパッタリング装置内で成膜直後の前記薄膜の光学特性値および基板温度を測定する。その測定結果を基に、成膜した薄膜の光学特性を評価する。【選択図】図1

    Abstract translation: 要解决的问题:提供一种通过精确控制通过溅射法沉积的薄膜的状态来稳定掩模坯料的质量的方法。解决方案:用于形成转印图案的薄膜是 通过使用单片式溅射装置和溅射法沉积在基板上以制造掩模板。 在单片式溅射装置中将薄膜沉积在基板上之后,在单片式溅射装置中测量刚刚沉积后的薄膜的光学特性值和基板的温度。 基于测量结果评价沉积的薄膜的光学特性值。

    Mask blank, transfer mask, production method of transfer mask, and method for manufacturing semiconductor device
    4.
    发明专利
    Mask blank, transfer mask, production method of transfer mask, and method for manufacturing semiconductor device 有权
    掩模布,转印掩模,转印掩模的生产方法和制造半导体器件的方法

    公开(公告)号:JP2013076989A

    公开(公告)日:2013-04-25

    申请号:JP2012186141

    申请日:2012-08-27

    CPC classification number: G03F1/26 B82Y10/00 B82Y30/00 G03F1/28 G03F1/58 G03F7/20

    Abstract: PROBLEM TO BE SOLVED: To provide a mask blank and a transfer mask having a light-shielding film with a reduced EMF (electromagnetic field) bias, which greatly reduces various loads relating to the production of a transfer mask, and suppressing exposure of a resist film on a wafer by leaked light due to overlap exposure.SOLUTION: The mask blank is to be used for creating a binary mask to which ArF excimer laser exposure light is applied, and includes a light-shielding film for forming a transfer pattern on a light-transmitting substrate. The light-shielding film has a layered structure of a lower layer and an upper layer and has an optical density of 2.8 or more to exposure light. The lower layer is formed of a material comprising tantalum containing nitrogen and has a film thickness of 33 nm or more. The upper layer is formed of a material comprising tantalum containing oxygen and has a film thickness of 3 nm or more. A phase difference between exposure light transmitted through the light-shielding film and exposure light transmitted through air in a distance equal to the film thickness of the light-shielding film is 60 degrees or less.

    Abstract translation: 要解决的问题:提供具有减小的EMF(电磁场)偏压的具有遮光膜的掩模坯料和转印掩模,这大大降低了与生产转印掩模有关的各种负载,并抑制曝光 通过由于重叠曝光而被泄漏的光在晶片上的抗蚀剂膜。 解决方案:掩模板用于创建施加ArF准分子激光曝光光的二进制掩模,并且包括用于在透光基板上形成转印图案的遮光膜。 遮光膜具有下层和上层的分层结构,并且对于曝光光具有2.8或更大的光密度。 下层由含有氮的钽的材料形成,膜厚为33nm以上。 上层由包含含氧钽的材料形成,膜厚度为3nm以上。 透过遮光膜的曝光光与透过空气的曝光光的距离等于遮光膜的膜厚的相位差为60度以下。 版权所有(C)2013,JPO&INPIT

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