公开(公告)号：AU2002336634A1

公开(公告)日：2003-04-14

申请号：AU2002336634

申请日：2002-09-20

Applicant: HRL LAB LLC

Inventor： HUNTER ANDREW T ,  DECKARD LUISA M ,  BREWER PETER D

IPC: H01L21/58 ,  H01L21/98 ,  H01L23/13 ,  H01L25/065 ,  H01L29/06

Abstract: A method for assembly including the steps of: (a) providing a plurality of microstructure components with each of the components having a bottom with the same three dimensional shape; (b) forming a mold with at least one protuberance from a surface thereof so that the at least one protuberance has the same shape; (c) molding a moldable substrate with the mold to form a molded substrate having a surface with at least one recess having the same shape; and (d) positioning a first of the plurality of microstructure components into said at least one recess. Each of the microstructure components may be formed by a masking and etching process, with the mold being formed by the same masking and etching process. The positioning step may consist of mixing the microstructure components with a fluid to form a slurry; and depositing the slurry on the surface of the molded substrate to cause the first of the plurality of microstructure components to self-align in the recess.

公开(公告)号：WO03035353A9

公开(公告)日：2003-10-30

申请号：PCT/US0233729

申请日：2002-10-18

Applicant: HRL LAB LLC ,  DECKARD LUISA M ,  ZINCK JENNIFER J

Inventor： DECKARD LUISA M ,  ZINCK JENNIFER J

IPC: B29C35/08 ,  B29C67/00 ,  B29C70/00 ,  B29C70/54 ,  B29C70/70 ,  B29C70/24

CPC classification number: B29C70/00 ,  B29C64/165 ,  B29C70/54 ,  B29C70/70 ,  B29C2035/0877 ,  B33Y10/00

Abstract: A method for making a part, the method comprising: (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform (3), or a base layer, wherein the uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (b) optionally providing a new uncured upper layer on the uncured upper layer provided in step (a), (c) curing the uncured upper layer (10) and/or the uncured lower layer after step (b) using an electron beam; optionally repeating steps (e) through (b) a number of times to form a desired number of cured layers.

Abstract translation: 一种用于制造零件的方法，该方法包括：（a）在零件，衬底，工件，支撑平台（3）或基层上提供未固化的上层，其中未固化的上层包含树脂，还有 包括纤维，颗粒，粉末和/或电子器件; （b）任选地在步骤（a）中提供的未固化的上层上提供新的未固化的上层，（c）使用电子束在步骤（b）之后固化未固化的上层（10）和/或未固化的下层; 任选重复步骤（e）至（b）多次以形成所需数量的固化层。