METHOD OF SELF-LATCHING FOR ADHESION DURING SELF-ASSEMBLY OF ELECTRONIC OR OPTICAL COMPONENTS
    1.
    发明申请
    METHOD OF SELF-LATCHING FOR ADHESION DURING SELF-ASSEMBLY OF ELECTRONIC OR OPTICAL COMPONENTS 审中-公开
    电子或光学元件自组装自粘式自粘式方法

    公开(公告)号:WO03028094A2

    公开(公告)日:2003-04-03

    申请号:PCT/US0230988

    申请日:2002-09-26

    Abstract: A method for assembling components on a substrate including the steps of: (a) selectively coating at least a first receptor site of the substrate with a liquid precursor that forms a solid adhesive upon contact with an initiator; (b) providing each of the components with an adhesion surface that has the initiator; and (c) depositing the components on the substrate in a manner that causes a first of the components to contact the at least first receptor site whereupon contact between the initiator and the liquid precursor causes formation of the adhesive which affixes the first compound to the first receptor site. In a preferred embodiment of the invention, the precursor is a liquid monomer and the initiator initiates a polymerization reaction upon contact with the monomer to form a solid polymer.

    Abstract translation: 一种用于在基板上组装部件的方法,包括以下步骤:(a)用与引发剂接触时形成固体粘合剂的液体前体选择性地涂覆基材的至少第一受体部位; (b)为每个组分提供具有引发剂的粘合表面; 和(c)以使得第一组分接触至少第一受体部位的方式将组分沉积在衬底上,因​​此引发剂和液体前体之间的接触导致粘合剂的形成,所述粘合剂将第一化合物固定到第一 受体位点。 在本发明的优选实施方案中,前体是液体单体,并且引发剂在与单体接触时引发聚合反应以形成固体聚合物。

    Method for assembly of complementary-shaped receptacle site and device microstructures

    公开(公告)号:AU2002336634A1

    公开(公告)日:2003-04-14

    申请号:AU2002336634

    申请日:2002-09-20

    Applicant: HRL LAB LLC

    Abstract: A method for assembly including the steps of: (a) providing a plurality of microstructure components with each of the components having a bottom with the same three dimensional shape; (b) forming a mold with at least one protuberance from a surface thereof so that the at least one protuberance has the same shape; (c) molding a moldable substrate with the mold to form a molded substrate having a surface with at least one recess having the same shape; and (d) positioning a first of the plurality of microstructure components into said at least one recess. Each of the microstructure components may be formed by a masking and etching process, with the mold being formed by the same masking and etching process. The positioning step may consist of mixing the microstructure components with a fluid to form a slurry; and depositing the slurry on the surface of the molded substrate to cause the first of the plurality of microstructure components to self-align in the recess.

    Method of self-assembly of electronic or optical components using an adhesive

    公开(公告)号:AU2002337764A1

    公开(公告)日:2003-04-07

    申请号:AU2002337764

    申请日:2002-09-26

    Applicant: HRL LAB LLC

    Abstract: A method for assembling components on a substrate including the steps of: (a) selectively coating at least a first receptor site of the substrate with a liquid precursor that forms a solid adhesive upon contact with an initiator; (b) providing each of the components with an adhesion surface that has the initiator; and (c) depositing the components on the substrate in a manner that causes a first of the components to contact the at least first receptor site whereupon contact between the initiator and the liquid precursor causes formation of the adhesive which affixes the first compound to the first receptor site. In a preferred embodiment of the invention, the precursor is a liquid monomer and the initiator initiates a polymerization reaction upon contact with the monomer to form a solid polymer.

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