公开(公告)号：ES2006049A6

公开(公告)日：1989-04-01

申请号：ES8800093

申请日：1988-01-15

Applicant: HUGHES AIRCRAFT CO

Inventor： CHANG DAVID B ,  BERG MICHAEL F ,  DRUMMOND JAMES E ,  MICKELSON LEE

IPC: G01N25/72

Abstract: SE TRATA DE UN SISTEMA PARA INSPECCIONAR LA INTEGRIDAD ELECTRONICA DE LAS JUNTAS O UNIONES DE SOLDADURA MEDIANTE CALENTAMIENTO REPETITIVO (POR IMPULSOS) DE LAS JUNTAS DE SOLDADURA CON ENERGIA RADIANTE Y DETERMINANDO LA OSCILACION DE TEMPERATURA DE LAS JUNTAS DE SOLDADURA ASI CALENTADAS POR IMPULSOS, MIDIENDO PARA ELLO LAS EMISIONES DE RAYOS INFRARROJOS PROCEDENTES DE LAS JUNTAS DE SOLDADURA DURANTE LOS PERIODOS DE CALENTAMIENTO Y DE AUSENCIA DE CALENTAMIENTO. PARA MAYOR VENTAJA, LAS JUNTAS DE SOLDADURA EXPUESTAS DE UNA PLACA DE CIRCUITOS PUEDEN SER PROBADAS O ENSAYADAS TODAS DE UNA VEZ, CALENTANDO POR IMPULSOS LA PLACA ENTERA DE CIRCUITOS. LA OSCILACION DE TEMPERATURA DE CADA JUNTA PUEDE SER COMPARADA CON LAS OSCILACIONES DE TEMPERATURA DE UNAS JUNTAS DE SOLDADURA STANDAR CORRESPONDIENTES, DE BUENA INTEGRIDED ELECTRONICA CONOCIDA, EN PLACAS DE CIRCUITOS QUE FUNCIONAN ADECUADAMENTE.

公开(公告)号：GB2199942B

公开(公告)日：1991-05-08

申请号：GB8800085

申请日：1988-01-05

Applicant: HUGHES AIRCRAFT CO

Inventor： CHANG DAVID B ,  BERG MICHAEL F ,  DRUMMOND JAMES E ,  MICKELSON LEE

IPC: G01N25/72

Abstract: A system for inspecting the electronic integrity of solder joints by repetitive pulse-heating the solder joints with radiant energy and determining the temperature oscillation of pulse-heated solder joints by measuring the infrared emissions from the solder joints during heating and non-heating periods. Advantageously, the exposed solder joints of a circuit board can be tested all at one time by pulse-heating the entire circuit board. The temperature oscillation of each joint can be compared to the temperature oscillations of corresponding standard solder joints of known good electronic integrity on properly operating boards.

公开(公告)号：GB2199942A

公开(公告)日：1988-07-20

申请号：GB8800085

申请日：1988-01-05

Applicant: HUGHES AIRCRAFT CO

Inventor： CHANG DAVID B ,  BERG MICHAEL F ,  DRUMMOND JAMES E ,  MICKELSON LEE

IPC: G01N25/72

Abstract: A system for inspecting the electronic integrity of solder joints by repetitive pulse-heating the solder joints with radiant energy and determining the temperature oscillation of pulse-heated solder joints by measuring the infrared emissions from the solder joints during heating and non-heating periods. Advantageously, the exposed solder joints of a circuit board can be tested all at one time by pulse-heating the entire circuit board. The temperature oscillation of each joint can be compared to the temperature oscillations of corresponding standard solder joints of known good electronic integrity on properly operating boards.