公开(公告)号：WO1988001827A1

公开(公告)日：1988-03-10

申请号：PCT/US1987001708

申请日：1987-07-20

Applicant: HUGHES AIRCRAFT COMPANY

Inventor： HUGHES AIRCRAFT COMPANY ,  LEATHAM, James, G.

IPC: H05K03/30

CPC classification number: B29C66/472 ,  B23K1/018 ,  B23K2101/42 ,  B29C65/3428 ,  B29C65/348 ,  B29C65/76 ,  B29C66/1122 ,  B29L2031/3425 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0212 ,  H05K3/30 ,  H05K3/305 ,  H05K3/321 ,  H05K3/341 ,  H05K3/3494 ,  H05K13/0486 ,  H05K2201/0209 ,  H05K2201/09263 ,  H05K2201/09772 ,  H05K2201/10969 ,  H05K2203/1115 ,  Y02P70/613 ,  H01L2924/00

Abstract: A circuit package, or other device, (10) is mounted on a printed circuit board, or other substrate, (14) with an electrically conductive sinuous resistor wire structure 30 therebetween to define a space filled with adhesive. When the adhesive is set the package is held in place. When removal is desired, current is passed through the sinuous wire structure to soften the adhesive to permit removal of the package without damage to the package or the board.

公开(公告)号：EP0280700B1

公开(公告)日：1992-11-11

申请号：EP87905333.8

申请日：1987-07-20

Applicant: Hughes Aircraft Company

Inventor： LEATHAM, James, G.

IPC: H05K3/30 ,  B23K1/00

CPC classification number: B29C66/472 ,  B23K1/018 ,  B23K2201/42 ,  B29C65/3428 ,  B29C65/348 ,  B29C65/76 ,  B29C66/1122 ,  B29L2031/3425 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0212 ,  H05K3/30 ,  H05K3/305 ,  H05K3/321 ,  H05K3/341 ,  H05K3/3494 ,  H05K13/0486 ,  H05K2201/0209 ,  H05K2201/09263 ,  H05K2201/09772 ,  H05K2201/10969 ,  H05K2203/1115 ,  Y02P70/613 ,  H01L2924/00

Abstract: A circuit package, or other device, (10) is mounted on a printed circuit board, or other substrate, (14) with an electrically conductive sinuous resistor wire structure (30) therebetween to define a space filled with adhesive. When the adhesive is set the package is held in place. When removal is desired, current is passed through the sinuous wire structure to soften the adhesive to permit removal of the package without damage to the package or the board.

公开(公告)号：EP0280700A1

公开(公告)日：1988-09-07

申请号：EP87905333.0

申请日：1987-07-20

Applicant: Hughes Aircraft Company

Inventor： LEATHAM, James, G.

IPC: H05K3 ,  B23K1 ,  B29C65 ,  H01L23 ,  H05K1 ,  H05K7 ,  H05K13

CPC classification number: B29C66/472 ,  B23K1/018 ,  B23K2201/42 ,  B29C65/3428 ,  B29C65/348 ,  B29C65/76 ,  B29C66/1122 ,  B29L2031/3425 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0212 ,  H05K3/30 ,  H05K3/305 ,  H05K3/321 ,  H05K3/341 ,  H05K3/3494 ,  H05K13/0486 ,  H05K2201/0209 ,  H05K2201/09263 ,  H05K2201/09772 ,  H05K2201/10969 ,  H05K2203/1115 ,  Y02P70/613 ,  H01L2924/00

Abstract: Un module de circuit, ou un autre dispositif (10) est monté sur une carte de circuit imprimé, ou un autre substrat (14), une structure (30) de fil métallique de résistance sinueux électroconducteur étant intercalée pour définir un espace rempli d'adhésif. Lorsque l'adhésif a durci, le module est maintenu en place. Lorsqu'on désire enlever le module, on fait passer un courant à travers la structure de fil métallique sinueux afin de ramollir l'adhésif en vue de permettre la dépose du module sans endommager ce dernier ou la carte de circuit imprimé.