公开(公告)号：US09883582B2

公开(公告)日：2018-01-30

申请号：US14947437

申请日：2015-11-20

Applicant: Hamilton Sundstrand Corporation

Inventor： Tran Lin

IPC: H05K1/02 ,  H01L23/15 ,  H01L23/367 ,  H01L23/50 ,  H01L23/498 ,  H05K1/18 ,  H05K1/11 ,  G01R31/02 ,  G01R31/04 ,  H05K3/22

CPC classification number: H05K1/0268 ,  G01R31/026 ,  G01R31/046 ,  H01L23/15 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/50 ,  H05K1/0206 ,  H05K1/0215 ,  H05K1/111 ,  H05K1/181 ,  H05K3/225 ,  H05K3/3421 ,  H05K2201/094 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2203/16 ,  H05K2203/162 ,  Y02P70/613

Abstract: A printed circuit board includes a body and a belly pad seated within with the body. The belly pad is electrically separated into a first pad and a second pad. The first pad and the second pad are arranged to be electrically connected to one another by an interconnect electrically connecting the belly pad to a conductive plane of an electrical component, thereby allowing continuity testing across an interface between the first pad and the interconnect.

公开(公告)号：US10764994B2

公开(公告)日：2020-09-01

申请号：US15848576

申请日：2017-12-20

Applicant: Hamilton Sundstrand Corporation

Inventor： Tran Lin

IPC: G01R31/70 ,  H05K1/02 ,  H05K3/34 ,  G01R31/50 ,  H01L23/15 ,  H01L23/367 ,  H01L23/498 ,  H01L23/50 ,  H05K1/11 ,  H05K1/18 ,  H05K3/22

Abstract: A printed circuit board includes a body and a belly pad seated within with the body. The belly pad is electrically separated into a first pad and a second pad. The first pad and the second pad are arranged to be electrically connected to one another by an interconnect electrically connecting the belly pad to a conductive plane of an electrical component, thereby allowing continuity testing across an interface between the first pad and the interconnect. Methods of testing continuity in electrical assemblies are also disclosed.

公开(公告)号：US20180116047A1

公开(公告)日：2018-04-26

申请号：US15848576

申请日：2017-12-20

Applicant: Hamilton Sundstrand Corporation

Inventor： Tran Lin

IPC: H05K1/02 ,  H01L23/50 ,  H05K3/22 ,  H05K1/18 ,  H05K1/11 ,  G01R31/02 ,  H01L23/498 ,  H01L23/367 ,  H01L23/15 ,  G01R31/04

Abstract: A printed circuit board includes a body and a belly pad seated within with the body. The belly pad is electrically separated into a first pad and a second pad. The first pad and the second pad are arranged to be electrically connected to one another by an interconnect electrically connecting the belly pad to a conductive plane of an electrical component, thereby allowing continuity testing across an interface between the first pad and the interconnect. Methods of testing continuity in electrical assemblies are also disclosed.

公开(公告)号：US20170150595A1

公开(公告)日：2017-05-25

申请号：US14947437

申请日：2015-11-20

Applicant: Hamilton Sundstrand Corporation

Inventor： Tran Lin

IPC: H05K1/02 ,  H01L23/367 ,  H01L23/50 ,  H05K3/22 ,  H05K1/18 ,  H05K1/11 ,  G01R31/02 ,  G01R31/04 ,  H01L23/15 ,  H01L23/498

CPC classification number: H05K1/0268 ,  G01R31/026 ,  G01R31/046 ,  H01L23/15 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/50 ,  H05K1/0206 ,  H05K1/0215 ,  H05K1/111 ,  H05K1/181 ,  H05K3/225 ,  H05K3/3421 ,  H05K2201/094 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2203/16 ,  H05K2203/162 ,  Y02P70/613

Abstract: A printed circuit board includes a body and a belly pad seated within with the body. The belly pad is electrically separated into a first pad and a second pad. The first pad and the second pad are arranged to be electrically connected to one another by an interconnect electrically connecting the belly pad to a conductive plane of an electrical component, thereby allowing continuity testing across an interface between the first pad and the interconnect.