公开(公告)号：EP2678265A2

公开(公告)日：2014-01-01

申请号：EP12710454.5

申请日：2012-02-24

Applicant: Harting KGAA

Inventor： GATZEN, Hans-Heinrich ,  GRIESBACH, Tim

IPC: B81B3/00

CPC classification number: H05K1/0271 ,  B81B3/0072 ,  B81B2201/11 ,  B81C2201/0167 ,  H05K3/303 ,  Y10T29/49133

Abstract: The invention relates to space-saving micro- and nano-components and to methods for producing same. The components are characterized in that they do not comprise a rigid substrate having a considerable thickness. The mechanical stresses, which result in deformations and/or warpage within a component, are compensated by means of a mechanically stress-compensated design and/or by means of active mechanical stress compensation by depositing suitable stress compensation layers such that there is no need for relatively thick substrates. Thus, the overall thickness of the components is decreased and the integration options thereof in technical systems are improved. In addition, the field of application of such components is expanded.