公开(公告)号：US20110232942A1

公开(公告)日：2011-09-29

申请号：US13069741

申请日：2011-03-23

Applicant: Hiroyuki UEMATSU

Inventor： Hiroyuki UEMATSU

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K3/427 ,  H05K1/0271 ,  H05K1/116 ,  H05K3/06 ,  H05K3/4007 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0166 ,  H05K2201/0355 ,  H05K2201/10977 ,  Y10T29/49124

Abstract: A multi-layer wiring board includes a substrate; a land including a first conductive member arranged on the substrate; a second conductive member that is deposited on a surface of the first conductive member, which is a surface distant from the substrate; and a stress relaxation layer arranged between the first conductive member and the second conductive member; and a connection portion that makes contact with the land and that is electrically connected to the land.

Abstract translation: 多层布线基板包括基板; 包括布置在所述基板上的第一导电构件的平台; 第二导电构件，其沉积在所述第一导电构件的表面上，所述第一导电构件是远离所述衬底的表面; 以及布置在所述第一导电构件和所述第二导电构件之间的应力松弛层; 以及与该焊盘接触并且与该焊盘电连接的连接部。

公开(公告)号：US20120138346A1

公开(公告)日：2012-06-07

申请号：US13310959

申请日：2011-12-05

Applicant: Hiroyuki UEMATSU ,  Kenichi KAWABATA

Inventor： Hiroyuki UEMATSU ,  Kenichi KAWABATA

IPC: H05K1/03 ,  H05K3/30 ,  H05K13/04 ,  H05K3/42 ,  H05K3/40

CPC classification number: H05K1/115 ,  H01L2224/04105 ,  H05K1/185 ,  H05K1/188 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/427 ,  H05K2201/0187 ,  H05K2201/09563 ,  H05K2203/095 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49165

Abstract: A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating an the inner wall of the via formation hole.

Abstract translation: 布线基板或电子部件嵌入基板包括：基板，其具有含有多个填料的树脂; 以及通孔，其电连接到提供给基板的至少一个互连件，其中所述通孔包括混合区域，在所述混合区域中，在相对于所述基板的内径向侧的所述填料之间设置有金属。 制造布线板或电子部件嵌入式基板的方法包括制备包括含有多种填料的树脂的基板; 在所述基板中形成通孔形成孔; 在通孔形成孔的至少内壁上进行灰化处理; 并且对通孔形成孔的内壁进行化学镀。