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公开(公告)号：US09746625B2
公开(公告)日：2017-08-29
申请号：US15222550
申请日：2016-07-28
Applicant: Hisense Broadband MultiMedia Technologies Co., Ltd. , Hisense USA Corp. , Hisense International Co., Ltd.
Inventor： Wei Zhao , Wei Cui , Hongchao Pan , Yinlong Liu , Lin Yu
CPC classification number: G02B6/4257 , G02B6/3825 , G02B6/4278 , G02B6/428 , G02B6/4284 , G02B6/4292
Abstract: The embodiments of the present disclosure disclose an optical module, comprising a housing, an adaptor and an optical sub-module being provided inside the housing, the adaptor being fixed with the optical sub-module, wherein an optical port component is also provided inside the housing, the optical port component is located at one side of the adaptor far away from the optical sub-module, and an opening is formed at one end of the optical port component far away from the adaptor; a through hole for the optical port component is formed on an end surface of the optical port component close to the adaptor, the adaptor can pass through the through hole for the optical port component to be fixed with the optical port component, and an optical fiber can be inserted into the adaptor from the opening.
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公开(公告)号：US12272928B2
公开(公告)日：2025-04-08
申请号：US17219200
申请日：2021-03-31
Abstract: An optical transmission module includes a housing having a cavity therein and an optical transmission device encapsulated in the cavity. The optical transmission device includes an optical waveguide substrate, laser assemblies, an optical multiplexing assembly and main waveguides. The optical waveguide substrate includes a surface and a first reflection inclined surface having an acute angle therebetween. The laser assemblies are disposed on the surface of the optical waveguide substrate, and are configured to emit laser beams towards the surface of the optical waveguide substrate. The optical multiplexing assembly is disposed in the optical waveguide substrate, and is configured to combine the laser beams into a laser beam. The main waveguides are disposed inside the optical waveguide substrate, light inlet ends of the main waveguides face the first inclined surface, and light outlet ends of the main waveguides are communicated with the optical multiplexing assembly.
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公开(公告)号：US10393971B2
公开(公告)日：2019-08-27
申请号：US15229764
申请日：2016-08-05
Applicant: Hisense Broadband MultiMedia Technologies Co., Ltd , HISENSE USA CORP. , Hisense International Co., Ltd.
Inventor： Wei Zhao , Hongchao Pan , Yinlong Liu , Wei Cui , Lin Yu
Abstract: Some embodiments of the present disclosure disclose a pluggable optical module, comprising a housing and an electromagnetic interference shielding clip clamped on the housing; a conductive member is provided between the housing and the electromagnetic interference shielding clip; and when the pluggable optical module is inserted into an optical module cage, the conductive member can block a gap between the housing and the electromagnetic interference shielding clip.
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Patent Agency Ranking
公开(公告)号：US10042132B2
公开(公告)日：2018-08-07
申请号：US15229749
申请日：2016-08-05
Applicant: Hisense Broadband MultiMedia Technologies Co., Ltd , HISENSE USA CORP. , Hisense International Co., Ltd.
IPC: G02B6/42
Abstract: Some embodiments of the present disclosure disclose an optical module. The optical module comprises a housing; a circuit board is provided inside the housing, and a connecting finger pluggable in an optical module cage is provided on the circuit board. At least one reflector, which is located between the connecting finger and an optical port of the optical module and can reflect electromagnetic waves radiated onto a surface of the reflector, is provided between the circuit board and the housing.
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公开(公告)号：US10912200B2
公开(公告)日：2021-02-02
申请号：US15982240
申请日：2018-05-17
Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD. , HISENSE USA CORORATION , HISENSE INTERNATIONAL CO., LTD.
Abstract: The application provides a printed circuit board and an optical module so as to alleviate poor contact between the electro-conductive contact sheet group and the clamping piece due to the solder resist. The printed circuit board includes a substrate, and electro-conductive contact sheet group positioned on the surface of the substrate, where a part of the substrate is overlaid with solder resist, and there is a gap between the solder resist and the electro-conductive contact sheet group.
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公开(公告)号：US10578816B2
公开(公告)日：2020-03-03
申请号：US16026868
申请日：2018-07-03
Applicant: Hisense Broadband MultiMedia Technologies Co., Ltd. , HISENSE USA CORP. , HISENSE INTERNATIONAL CO., LTD.
IPC: G02B6/42
Abstract: An optical module includes a housing, a circuit board, a connecting finger and a reflector. The circuit board is provided inside the housing. The connecting finger is provided on the circuit board. The reflector is provided between the circuit board and the housing, and is located between the connecting finger and an optical port of the optical module. The reflector is configured to reflect electromagnetic waves radiated onto a surface of the reflector.
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公开(公告)号：US20200183107A1
公开(公告)日：2020-06-11
申请号：US16746470
申请日：2020-01-17
Applicant: Hisense Broadband Multimedia Technologies Co., Ltd. , HISENSE USA CORP. , Hisense International Co., Ltd.
IPC: G02B6/42
Abstract: An optical module includes a housing, a circuit board, a connecting finger and a reflector. The circuit board is provided inside the housing. The connecting finger is provided on the circuit board. The reflector is provided between the circuit board and the housing, and is located between the connecting finger and an optical port of the optical module. The reflector is configured to reflect electromagnetic waves radiated onto a surface of the reflector.
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公开(公告)号：US09999130B2
公开(公告)日：2018-06-12
申请号：US15258330
申请日：2016-09-07
CPC classification number: H05K1/18 , H05K1/0298 , H05K1/117 , H05K3/3452 , H05K2201/0137 , H05K2201/10121
Abstract: The application provides a printed circuit board and an optical module so as to alleviate poor contact between the electro-conductive contact sheet group and the clamping piece due to the solder resist. The printed circuit board includes a substrate, and electro-conductive wirings and electro-conductive contact sheet group both laid on the surface of the substrate, where the substrate is overlaid with solder resist, and the solder resist has no contact with the electro-conductive contact sheet group.
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