中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

3 records (took 0.026 seconds)

    DEVICE WITH HEAT INSULATION STRUCTURE
    1.
    发明公开
    DEVICE WITH HEAT INSULATION STRUCTURE 审中-公开
    VORRICHTUNG MITWÄRMEDÄMMUNGSSTRUKTUR

    公开(公告)号：EP2661164A2

    公开(公告)日：2013-11-06

    申请号：EP11789253.9

    申请日：2011-06-14

    Applicant: Huawei Device Co., Ltd.

    Inventor： ZOU, Jie ,  ZHOU, Liechun ,  WU, Xijie ,  YANG, Jun

    IPC: H05K7/20

    CPC classification number: H05K7/20 ,  H01M10/658 ,  H05K5/0213

    Abstract: Embodiments of the present invention provide an apparatus with a heat insulation structure, where the apparatus includes an object to be heat-insulated (10) and also includes a heat insulation closed layer (20), disposed between the object to be heat-insulated (10) and a heat source (30). The heat insulation structure adopted in the present invention specifically is a heat insulation closed layer (20), where the heat insulation closed layer (20) performs heat insulation protection through a closed space between the object to be heat-insulated (10) and the heat source (30), rather than performing heat insulation mainly through a physical material with a small heat conduction coefficient. By performing heat insulation through the closed space, heat conducted through direct contact is reduced, and the closed space can effectively decrease heat transmission in forms of heat convection and heat radiation, solving a problem that heat is transferred from the heat source to the object to be heat-insulated, improving a heat insulation effect and lowering the temperature of a work environment of the object to be heat-insulated.

    Abstract translation: 本发明的实施例提供了一种具有隔热结构的装置，其中该装置包括要被隔热的物体（10），并且还包括设置在被绝热物体（20）之间的绝热封闭层（20） 10）和热源（30）。 本发明中采用的隔热结构具体是隔热封闭层（20），其中隔热封闭层（20）通过待绝热物体（10）和绝热物体（10）之间的封闭空间进行隔热保护， 热源（30），而不是主要通过具有小导热系数的物理材料进行绝热。 通过封闭空间进行隔热，通过直接接触传导的热量减少，封闭空间可有效地减少热对流和热辐射的热传递，解决了热量从热源传递到物体的问题 隔热，提高隔热效果，降低被隔热物体的作业环境的温度。

    COMPOSITE MATERIAL AND ELECTRON DEVICE
    3.
    发明公开
    COMPOSITE MATERIAL AND ELECTRON DEVICE 有权
    VERBUNDSTOFF UND ELEKTRONENVORRICHTUNG

    公开(公告)号：EP2685797A2

    公开(公告)日：2014-01-15

    申请号：EP11777176.6

    申请日：2011-05-06

    Applicant: Huawei Device Co., Ltd.

    Inventor： YANG, Jun ,  ZHOU, Liechun ,  LI, Hualin ,  WU, Xijie

    IPC: H05K7/20 ,  H05K9/00

    CPC classification number: H05K1/0204 ,  H01L23/552 ,  H01L24/18 ,  H05K1/0216 ,  H05K7/20472 ,  H05K9/003 ,  H05K2201/0715 ,  H05K2201/2018 ,  Y02D70/122 ,  Y10T428/264 ,  Y10T428/30 ,  Y10T428/31504 ,  Y10T428/31678

    Abstract: A composite material and an electronic device are disclosed in embodiments of the present invention, relating to the field of electronic assembly technologies. The technical problem of the existing electronic device with an excessively complicated internal structure is solved. The composite material includes an electrically and thermally conductive layer, a viscose glue layer, and an insulating layer, where the electrically and thermally conductive layer and the insulating layer are pasted at two sides of the viscose glue layer; and the viscose glue layer is electrically conductive. The electronic device includes a circuit board and the composite material. Gaps are formed at the insulating layer in positions corresponding to electronic components and/or shielding frames, with the viscose glue layer exposed, and the composite material is pasted onto the electronic components and/or the shielding frames via the viscose glue layer. The present invention is applied to simplify the structure of an electronic device.

    Abstract translation: 在本发明的实施例中公开了与电子组装技术领域有关的复合材料和电子装置。 解决了内部结构过于复杂的现有电子设备的技术问题。 复合材料包括导电导热层，粘胶层和绝缘层，其中导电层和绝缘层粘贴在粘胶层的两侧; 粘胶层是导电的。 电子装置包括电路板和复合材料。 在对应于电子部件和/或屏蔽框架的位置处在绝缘层处形成间隙，粘胶层露出，并且复合材料通过粘胶层粘贴到电子部件和/或屏蔽框架上。 本发明应用于简化电子设备的结构。

Patent Agency Ranking