Patent search ap:("IBM") AND inv:"AASAA YUUJIIN GUREIAMU" Page 1

1.

发明专利
CONDITIONING OF SUBSTRATE FOR ELECTROLESS PLATING ONTO SUBSTRATE 失效

公开(公告)号：JPH04232278A

公开(公告)日：1992-08-20

申请号：JP20900391

申请日：1991-08-21

Applicant: IBM

Inventor： HARII RANDORU BITSUKUFUOODO , DENISU ARAN KANFUIIRUDO , AASAA YUUJIIN GUREIAMU , SUTEIIBUN RIIOU TEISUDEIRU , ARUFURETSUDO BIIBETSUKU

IPC: C23C18/52 , C23C18/28 , C23C18/31 , H05K3/18

Patent Agency Ranking