Patent search ap:("IBM") AND inv:"ARUFURETSUDO BIIBETSUKU" Page 1

1.

发明专利
失效

公开(公告)号：JPH05247206A

公开(公告)日：1993-09-24

申请号：JP22859892

申请日：1992-08-27

Applicant: IBM

Inventor： AANESUTO ROJIYAA FURANKU , TERENSU ROBAATO OTOUURU , ARUFURETSUDO BIIBETSUKU

IPC: C08G73/06 , C08G73/10

2.

发明专利
SURFACE REFORMING OF POLYIMIDE 失效

公开(公告)号：JPH04231474A

公开(公告)日：1992-08-20

申请号：JP10819191

申请日：1991-04-15

Applicant: IBM

Inventor： RIINA PAIBITSUKI BUTSUKUUOORUT , SUTEIIBUN RESURII BUTSUKUUOORU , TERENSU ROBAATO OTOUURU , RICHIYAADO RONARUDO TOMASU , ARUFURETSUDO BIIBETSUKU

IPC: C08G73/10 , C08J7/12 , C09D179/08 , C09J5/02 , C23C18/20 , C23C18/22 , H05K3/38

3.

发明专利
MODIFIED DICYANATE ESTER RESIN OF HIGH FRACTURE TOUGHNESS 失效

公开(公告)号：JPH06107958A

公开(公告)日：1994-04-19

申请号：JP13321593

申请日：1993-06-03

Applicant: IBM

Inventor： ARI AFUZARIIARUDAKANI , JIEFURII TEII GOTOROO , JIEFURII SHII HEDORITSUKU , KONSUTANTEINOSU PAPATOMASU , NIRANJIYAN EMU PATERU , JIEIN EMU SHIYOO , ARUFURETSUDO BIIBETSUKU

IPC: B32B27/06 , C08G65/40 , C08G73/06 , C08G75/00 , C08G75/20 , C08G79/02 , C08G79/04 , C08J5/24 , C08L79/04 , C08L101/00 , C08L101/02 , C08L101/04 , H05K1/03

Abstract: A composition having enhanced fracture resistance comprising curable dicyanate ester resins having incorporated therein at least one thermoplastic polymer modifier which is soluble in the dicyanate ester resin. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase-separated multiphase thermoset material.

4.

发明专利
ELECTROLYTIC ACCUMULATION OF POLYMER 失效

公开(公告)号：JPH059792A

公开(公告)日：1993-01-19

申请号：JP1988992

申请日：1992-02-05

Applicant: IBM

Inventor： TERENSU ROBAATO OTOUURU , ARUFURETSUDO BIIBETSUKU

IPC: C08G73/10 , C09D5/44 , C25D13/06 , H01B3/30 , H01L23/29

5.

发明专利
METHOD OF EFFECTING NUCLEOPHILIC DERIVATION OF SUBSTANCE HAVING IMIDE GROUP CONJUGATED WITH AROMATIC PORTION 失效

公开(公告)号：JPH03109423A

公开(公告)日：1991-05-09

申请号：JP15781090

申请日：1990-06-18

Applicant: IBM

Inventor： MAATEIN JIYOZEFU GOORUDOBAAGU , DANIERU PIITAA MORISU , ARUFURETSUDO BIIBETSUKU

IPC: C25B3/04 , C08G73/10 , C08G85/00 , G03F7/038 , H05K1/03 , H05K3/18 , H05K3/38

6.

发明专利
DERIVATIVE OF COMPOUND CONTAINING CONJUGATED CARBONYL GROUPS IN THE AROMATIC PART AND ELECTROPHILIC MANUFACTURE THEREOF 失效

公开(公告)号：JPH03103440A

公开(公告)日：1991-04-30

申请号：JP15781190

申请日：1990-06-18

Applicant: IBM

Inventor： MAATEIN JIYOZEFU GOORUDOBAAGU , DANIERU PIITAA MORISU , ARUFURETSUDO BIIBETSUKU

IPC: C07D209/48 , C07B43/00 , C07B45/00 , C07D471/06 , C07D487/04 , C07D519/00 , C08G73/10 , C08G85/00 , C25B3/04 , H05K1/03 , H05K3/00 , H05K3/46

Abstract: Derivatives of compounds containing a carbonyl group conjugated to an aromatic moiety and methods of fabrication thereof consisting of a thioether, an ester, an ether, a phosphate and a silylether. Electrons are supplied to the carbonyl group conjugated to an aromatic moiety to form a reduced material. The reduced material is contacted with an electrophile which attacks and chemically combines with the carbonyl group conjugated to an aromatic moiety. The parent material can be regenerated by hydrolysis of the derivative. A silyl derivative can be selectively formed on a polyimide material surface which can act as a barrier to an RIE etch of the polyimide material. After etch the polyimide material is regenerated from the silyl derivative.

7.

发明专利
LOW PERMITTIVITY FLUORINATED POLYMER AND ITS PRODUCTION 失效

公开(公告)号：JPH06107791A

公开(公告)日：1994-04-19

申请号：JP13333193

申请日：1993-06-03

Applicant: IBM

Inventor： GARESU JIEFURII HAFUAMU , JIEIN MAAGARETSUTO SHIYOO , ARUFURETSUDO BIIBETSUKU

IPC: C08G73/10

8.

发明专利
METHOD OF CONDITIONING HALOGENATED POLYMER SUBSTANCES AND STRUCTURES COMPOSED OF THEM 失效

公开(公告)号：JPH0641763A

公开(公告)日：1994-02-15

申请号：JP16230391

申请日：1991-06-07

Applicant: IBM

Inventor： HARII RANDORU BITSUKUFUOODO , PIITAA JIEIMUZU DEYUUKU , ERIZABESU FUOSUTAA , MAATEIN JIYOZEFU GOORUDOBAAGU , BOYA RISUTA MARUKOBITSUKU , RINDA KARORIN MASHIYUU , DONARUDO JIIN MAKUBURAIDO , TERENSU ROBAATO OTOUURU , SUTEIIBUN RIIOU TEISUDEIRU , ARUFURETSUDO BIIBETSUKU

IPC: C08J3/24 , C23C18/20 , C23C18/28 , C25D5/56 , H05K1/03 , H05K3/18 , H05K3/38 , H05K3/42

9.

发明专利
CONDITIONING OF SUBSTRATE FOR ELECTROLESS PLATING ONTO SUBSTRATE 失效

公开(公告)号：JPH04232278A

公开(公告)日：1992-08-20

申请号：JP20900391

申请日：1991-08-21

Applicant: IBM

Inventor： HARII RANDORU BITSUKUFUOODO , DENISU ARAN KANFUIIRUDO , AASAA YUUJIIN GUREIAMU , SUTEIIBUN RIIOU TEISUDEIRU , ARUFURETSUDO BIIBETSUKU

IPC: C23C18/52 , C23C18/28 , C23C18/31 , H05K3/18

10.

发明专利
CROSSLINKING AND REDUCTION OF HALIDE 失效

公开(公告)号：JPH07173637A

公开(公告)日：1995-07-11

申请号：JP24634794

申请日：1994-10-12

Applicant: IBM

Inventor： HARII RANDORU BITSUKUFUOODO , PIITAA JIEIMUZU DEYUUKU , ERIZABESU FUOSUTAA , MAATEIN JIYOZEFU GOORUDOBAAGU , BOYA RISUTA MARUKOBITSUKU , RINDA KARORIN MASHIYUU , DONARUDO JIIN MAKUBURAIDO , TERENSU ROBAATO OTOUURU , SUTEIIBUN RIIOU TEISUDEIRU , ARUFURETSUDO BIIBETSUKU

IPC: C08J3/24 , C23C18/20 , C23C18/28 , C25D5/56 , H05K1/03 , H05K3/18 , H05K3/38 , H05K3/42

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