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公开(公告)号:CA1290079C
公开(公告)日:1991-10-01
申请号:CA601597
申请日:1989-06-02
Applicant: IBM
Inventor: AKBAR SHAH , KROESEN PATRICIA L , OGURA SEIKI , ROVEDO NIVO
IPC: H01L29/73 , G03C3/00 , H01L21/331 , H01L29/08 , H01L29/10 , H01L29/732 , H01L29/737 , H01L29/72 , H01L29/52 , H01L29/60
Abstract: VERTICAL BIPOLAR TRANSISTOR A Compressed vertical bipolar transistor configuration that eliminates one side of the standard symmetrical base contact, while also eliminating the requirement for a collector contact reach-thru. The bipolar transistor comprises: a collector layer;a base layer disposed over the collector layer; an emitter layer disposed over the base layer; a first sidewall insulating layer disposed adjacent to and in contact with one side of the emitter layer, the base layer, and at least a portion of the collector layer; a second sidewall insulating layer disposed adjacent to and in contact with another side of the emitter layer and at least a portion of the base layer; and a base contact extension layer formed from heavily doped semiconductor material of the same conductivity type as the base layer, said base contact extension layer being in contact with and extending laterally from another side of the base layer. The structure further includes a base contact interconnect disposed on a surface of the base contact extension layer and; a collector contact extension layer formed from doped semiconductor material with the same conductivity type as the collector layer, with the collector contact extension layer being in contact with the collector layer and extending laterally from or below the one side thereof; and a collector contact interconnect disposed on a surface of the collector contact extension layer and separated from said emitter layer by only one or more insulating layers. FI9-87-027
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公开(公告)号:BR8903812A
公开(公告)日:1990-03-20
申请号:BR8903812
申请日:1989-07-31
Applicant: IBM
Inventor: AKBAR SHAH , KROESEN PATRICIA LAVELLE , OGURA SEIKI , ROVEDO NIVO
IPC: H01L29/73 , G03C3/00 , H01L21/331 , H01L29/08 , H01L29/10 , H01L29/732 , H01L29/737 , H01L29/70
Abstract: A Compressed vertical bipolar transistor configuration that eliminates one side of the standard symmetrical base contact, while also eliminating the requirement for a collector contact reach-thru. The bipolar transistor comprises: a collector layer (12); a base layer (14) disposed over the collector layer; an emitter layer (16) disposed over the base layer; a first sidewall insulating layer (18) disposed adjacent to and in contact with one side of the emitter layer, the base layer, and at least a portion of the collector layer; a second sidewall insulating layer (20) disposed adjacent to and in contact with another side of the emitter layer and at least a portion of the base layer; and a base contact extension layer (22) formed from heavily doped semiconductor material of the same conductivity type as the base layer, said base contact extension layer being in contact with and extending laterally from another side of the base layer. The structure further includes a base contact interconnect (24) disposed on a surface of the base contact extension layer and; a collector contact extension layer (26) formed from doped semiconductor material with the same conductivity type as the collector layer, with the collector contact extension layer being in contact with the collector layer and extending laterally from or below the one side thereof; and a collector contact interconnect (29) disposed on a surface of the collector contact extension layer and separated from said emitter layer by only one or more insulating layers.
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公开(公告)号:IN177966B
公开(公告)日:1997-03-01
申请号:IN615DE1990
申请日:1990-06-21
Applicant: IBM
Inventor: AKBAR SHAH , LAVELLE PATRICIA , ROVEDO NIVO
IPC: H01L27/00
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公开(公告)号:DE68906095T2
公开(公告)日:1993-10-28
申请号:DE68906095
申请日:1989-06-29
Applicant: IBM
Inventor: AKBAR SHAH , KROESEN PATRICIA LAVELLE , OGURA SEIKI , ROVEDO NIVO
IPC: H01L29/73 , G03C3/00 , H01L21/331 , H01L29/08 , H01L29/10 , H01L29/732 , H01L29/737 , H01L29/72 , H01L29/52 , H01L29/60
Abstract: A Compressed vertical bipolar transistor configuration that eliminates one side of the standard symmetrical base contact, while also eliminating the requirement for a collector contact reach-thru. The bipolar transistor comprises: a collector layer (12); a base layer (14) disposed over the collector layer; an emitter layer (16) disposed over the base layer; a first sidewall insulating layer (18) disposed adjacent to and in contact with one side of the emitter layer, the base layer, and at least a portion of the collector layer; a second sidewall insulating layer (20) disposed adjacent to and in contact with another side of the emitter layer and at least a portion of the base layer; and a base contact extension layer (22) formed from heavily doped semiconductor material of the same conductivity type as the base layer, said base contact extension layer being in contact with and extending laterally from another side of the base layer. The structure further includes a base contact interconnect (24) disposed on a surface of the base contact extension layer and; a collector contact extension layer (26) formed from doped semiconductor material with the same conductivity type as the collector layer, with the collector contact extension layer being in contact with the collector layer and extending laterally from or below the one side thereof; and a collector contact interconnect (29) disposed on a surface of the collector contact extension layer and separated from said emitter layer by only one or more insulating layers.
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公开(公告)号:DE68906095D1
公开(公告)日:1993-05-27
申请号:DE68906095
申请日:1989-06-29
Applicant: IBM
Inventor: AKBAR SHAH , KROESEN PATRICIA LAVELLE , OGURA SEIKI , ROVEDO NIVO
IPC: H01L29/73 , G03C3/00 , H01L21/331 , H01L29/08 , H01L29/10 , H01L29/732 , H01L29/737 , H01L29/72 , H01L29/52 , H01L29/60
Abstract: A Compressed vertical bipolar transistor configuration that eliminates one side of the standard symmetrical base contact, while also eliminating the requirement for a collector contact reach-thru. The bipolar transistor comprises: a collector layer (12); a base layer (14) disposed over the collector layer; an emitter layer (16) disposed over the base layer; a first sidewall insulating layer (18) disposed adjacent to and in contact with one side of the emitter layer, the base layer, and at least a portion of the collector layer; a second sidewall insulating layer (20) disposed adjacent to and in contact with another side of the emitter layer and at least a portion of the base layer; and a base contact extension layer (22) formed from heavily doped semiconductor material of the same conductivity type as the base layer, said base contact extension layer being in contact with and extending laterally from another side of the base layer. The structure further includes a base contact interconnect (24) disposed on a surface of the base contact extension layer and; a collector contact extension layer (26) formed from doped semiconductor material with the same conductivity type as the collector layer, with the collector contact extension layer being in contact with the collector layer and extending laterally from or below the one side thereof; and a collector contact interconnect (29) disposed on a surface of the collector contact extension layer and separated from said emitter layer by only one or more insulating layers.
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