公开(公告)号：EP2274733A4

公开(公告)日：2014-06-11

申请号：EP08873919

申请日：2008-12-30

Applicant: IBM

Inventor： AKKERMANS JOHANNES A G ,  FLOYD BRIAN A ,  LIU DUIXIAN

IPC: G08B13/14 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q21/06 ,  H01Q23/00

CPC classification number: H01Q21/065 ,  G06K19/07749 ,  G06K19/07786 ,  H01L23/3121 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15323 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q9/0457 ,  H01Q21/061 ,  H01Q23/00 ,  Y10T29/49016

公开(公告)号：JP2010016789A

公开(公告)日：2010-01-21

申请号：JP2008276631

申请日：2008-10-28

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： AKKERMANS JOHANNES A G ,  BRIAN A FLOYD ,  DUIXIAN LIU

IPC: H01Q21/06 ,  H01L25/00 ,  H01Q13/08

CPC classification number: H01Q9/0457 ,  H01L23/66 ,  H01L24/48 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15313 ,  H01L2924/15323 ,  H01Q21/0075 ,  H01Q21/065 ,  Y10T29/49016 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: PROBLEM TO BE SOLVED: To provide a radio-frequency (RF) integrated circuit (IC) package having a characteristic suitable for mass production. SOLUTION: The radio-frequency integrated circuit chip package 100 having N-integrated aperture coupled patch antennas 104 (N is at least one) includes a cover part and a main part coupled to the cover part. The main part are arranged at intervals from the patch antenna 104 to the inside, and include the ground surface 110 parallel to it. The ground surface is formed so as to internally have the coupled apertural area slot 113. The slot 113 substantially faces the patch antenna 104. The main parts are also arranged at intervals from the patch antenna 104 to the inside, and include the feed line 114 in parallel to it and the radio-frequency chip 162 coupled to the feed line 114 and the ground surface 110. The cover part and the main part cooperatively set an antenna cavity 150, and the patch antenna 104 is arranged in the antenna cavity 150. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供具有适合于批量生产的特征的射频（RF）集成电路（IC）封装。 解决方案：具有N个集成的孔耦合贴片天线104（N至少为一个）的射频集成电路芯片封装100包括覆盖部分和耦合到盖部分的主要部分。 主要部分从贴片天线104间隔设置到内部，并且包括平行于其的接地表面110。 地表面形成为在内部具有耦合的开口区域槽113.槽113基本上面向贴片天线104.主要部分也从贴片天线104到内部间隔设置，并且包括馈线114 并且耦合到馈电线114和接地表面110的射频芯片16.盖部分和主要部分协作地设置天线腔150，并且贴片天线104布置在天线腔150中。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：CA2713353A1

公开(公告)日：2009-10-22

申请号：CA2713353

申请日：2008-12-30

Applicant: IBM

Inventor： AKKERMANS JOHANNES A G ,  FLOYD BRIAN A ,  LIU DUIXIAN

IPC: G08B13/14

Abstract: A radio-frequency integrated circuit chip package has N integrated aperture-coupled patch antennas, N being at least two, and includes N generally planar patches, and at least one generally planar ground plane. The ground plane is formed with at least N coupling aperture slots therein. N feed lines are spaced inwardly from the ground plane and substantially parallel thereto, and at least one radio-frequency chip is spaced inwardly from the feed lines and coupled to the feed lines and the ground plane. A first substrate layer is formed with the chip located in a chip-receiving cavity. A second substrate layer is interposed be-tween the ground plane and a plane defined by the patch. The patch is formed in a first metal layer, the ground plane in a second metal layer, and the second substrate layer defines an antenna cavity in which the N generally planar patches are located.

公开(公告)号：BRPI0822016A2

公开(公告)日：2015-07-21

申请号：BRPI0822016

申请日：2008-12-30

Applicant: IBM

Inventor： AKKERMANS JOHANNES A G ,  FLOYD BRIAN A ,  LIU DUIXIAN

IPC: G08B13/14

公开(公告)号：CA2713353C

公开(公告)日：2014-06-10

申请号：CA2713353

申请日：2008-12-30

Applicant: IBM

Inventor： AKKERMANS JOHANNES A G ,  FLOYD BRIAN A ,  LIU DUIXIAN

IPC: H01Q21/06 ,  H01Q1/38

Abstract: A radio-frequency integrated circuit chip package has N integrated aperture-coupled patch antennas, N being at least two, and includes N generally planar patches, and at least one generally planar ground plane. The ground plane is formed with at least N coupling aperture slots therein. N feed lines are spaced inwardly from the ground plane and substantially parallel thereto, and at least one radio-frequency chip is spaced inwardly from the feed lines and coupled to the feed lines and the ground plane. A first substrate layer is formed with the chip located in a chip-receiving cavity. A second substrate layer is interposed be-tween the ground plane and a plane defined by the patch. The patch is formed in a first metal layer, the ground plane in a second metal layer, and the second substrate layer defines an antenna cavity in which the N generally planar patches are located.