MANUFACTURE OF FIELD EFFECT TRANSISTOR HAVING BURIED MOTT MATERIAL OXIDE CHANNEL

    公开(公告)号:JP2000294796A

    公开(公告)日:2000-10-20

    申请号:JP2000065312

    申请日:2000-03-09

    Applicant: IBM

    Abstract: PROBLEM TO BE SOLVED: To obtain a structure and a manufacturing method of a FET having a buried Mott insulating oxide channel. SOLUTION: A structure and a forming method of a field effect transistor having a buried Mott insulating oxide channel comprises the steps of depositing a source electrode and a drain electrode on a substrate 101, forming a Mott transition channel layer 201 on the substrate 101 and the electrodes, forming an insulator layer on the Mott transition channel layer 201, forming a source contact and a drain contact via the insulator layer (so that the source contact and the drain contact are electrically connected to the Mott transition channel layer), and forming a gate electrode 402 on the insulator layer between the source contact and the drain contact.

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