MANUFACTURE OF FIELD EFFECT TRANSISTOR HAVING BURIED MOTT MATERIAL OXIDE CHANNEL

    公开(公告)号:JP2000294796A

    公开(公告)日:2000-10-20

    申请号:JP2000065312

    申请日:2000-03-09

    Applicant: IBM

    Abstract: PROBLEM TO BE SOLVED: To obtain a structure and a manufacturing method of a FET having a buried Mott insulating oxide channel. SOLUTION: A structure and a forming method of a field effect transistor having a buried Mott insulating oxide channel comprises the steps of depositing a source electrode and a drain electrode on a substrate 101, forming a Mott transition channel layer 201 on the substrate 101 and the electrodes, forming an insulator layer on the Mott transition channel layer 201, forming a source contact and a drain contact via the insulator layer (so that the source contact and the drain contact are electrically connected to the Mott transition channel layer), and forming a gate electrode 402 on the insulator layer between the source contact and the drain contact.

    COMPLEMENTARY FIELD-EFFECT TRANSISTOR STRUCTURE AND ITS MANUFACTURE

    公开(公告)号:JP2000332133A

    公开(公告)日:2000-11-30

    申请号:JP2000131749

    申请日:2000-04-28

    Applicant: IBM

    Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a complementary field-effect transistor structure having an oxide channel of a Mott material. SOLUTION: A method for manufacturing complementary field-effect transistor structure includes a step of forming a laminated structure having first and second sides. The first side has a first-type Mott channel layer 107 and the second side has a second-type Mott channel layer 106. A first source area 408 and a first drain area 409 are formed in the first side, and a second source area 302 and a second drain area 303 are formed in the second side. A first gate area 301 is formed in the second side and a second gate area 301 is formed in the first side. The first source, drain, and gate areas 408, 409, and 301 constitute a first-type field effect transistor, and the second source, drain, and gate areas 302, 303, and 412 constitute a second-type field effect transistor.

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