公开(公告)号：DE69113187D1

公开(公告)日：1995-10-26

申请号：DE69113187

申请日：1991-07-26

Applicant: IBM

Inventor： AMEEN JOSEPH G ,  FUNARI JOSEPH ,  GOLDFUSS JOHN A

IPC: H01L21/60 ,  H01L23/538 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H01L23/498

Abstract: A thin film electronic package which utilizes a circuitized substrate (e.g., a printed circuit board) having a flexible film carrier (11) electrically coupled thereto. The film carrier includes a dielectric layer (25) (e.g., polyimide) with first and second circuit layers (23, 27) located on opposite sides thereof. These circuit layers are interconnected, electrically, through the dielectric. An electronic device (13) (e.g., semiconductor chip) is electrically connected to bridging portions of the conductive leads of the carrier's first circuit layer, which bridging portions extend across apertures (29) provided within the dielectric. A plurality of solder elements (19) are utilized to provide electrical connection between respective contact locations of the electronic device and respective bridging portions of the first layer's conductive leads. Further a method of forming electrical connections between a flexible film carrier and an electronic device is described. The method comprises the steps of aligning the film carrier relative to the device having a plurality of solder mounds located on an upper surface thereof. The film carrier is engaged such that bridging portions of conductive leads thereof physically contact these solder mounds. Hot gas is passed through a screen member to heat the bridging portions of the leads to cause these leads to in turn heat the solder mounds to cause the mounds to become molten, whereafter these leads and mounds are cooled to form the desired solder bonds.

公开(公告)号：DE69113187T2

公开(公告)日：1996-05-02

申请号：DE69113187

申请日：1991-07-26

Applicant: IBM

Inventor： AMEEN JOSEPH G ,  FUNARI JOSEPH ,  GOLDFUSS JOHN A

IPC: H01L21/60 ,  H01L23/538 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H01L23/498

Abstract: A thin film electronic package which utilizes a circuitized substrate (e.g., a printed circuit board) having a flexible film carrier (11) electrically coupled thereto. The film carrier includes a dielectric layer (25) (e.g., polyimide) with first and second circuit layers (23, 27) located on opposite sides thereof. These circuit layers are interconnected, electrically, through the dielectric. An electronic device (13) (e.g., semiconductor chip) is electrically connected to bridging portions of the conductive leads of the carrier's first circuit layer, which bridging portions extend across apertures (29) provided within the dielectric. A plurality of solder elements (19) are utilized to provide electrical connection between respective contact locations of the electronic device and respective bridging portions of the first layer's conductive leads. Further a method of forming electrical connections between a flexible film carrier and an electronic device is described. The method comprises the steps of aligning the film carrier relative to the device having a plurality of solder mounds located on an upper surface thereof. The film carrier is engaged such that bridging portions of conductive leads thereof physically contact these solder mounds. Hot gas is passed through a screen member to heat the bridging portions of the leads to cause these leads to in turn heat the solder mounds to cause the mounds to become molten, whereafter these leads and mounds are cooled to form the desired solder bonds.

公开(公告)号：CA1163540A

公开(公告)日：1984-03-13

申请号：CA399068

申请日：1982-03-23

Applicant: IBM

Inventor： ABOLAFIA OSCAR R ,  AMEEN JOSEPH G

IPC: C23F1/26 ,  H05K3/06 ,  C09K13/00 ,  C23F1/00

Abstract: EN981-001 PROCESS FOR ETCHING CHROME AND COMPOSITION AS SUITABLE THEREFORE An aqueous acidic composition suitable for etching which contains an acid and a thiourea compound, and use thereof.

公开(公告)号：FR2346945A1

公开(公告)日：1977-10-28

申请号：FR7704269

申请日：1977-02-07

Applicant: IBM

Inventor： AMEEN JOSEPH G ,  ELMORE GLENN V N ,  PETER ANTHONY E

IPC: H05K3/28 ,  B23K1/00 ,  B23K35/22 ,  H05K3/00 ,  H05K3/34 ,  H05K13/04 ,  H01L49/00

Abstract: A polysulfone base stop resist material to protect gold thermocompression bonding sites on a circuit module during a solder dipping operation. Along with the thermoplastic, thermostable strippable base of polysulfone, the resist includes a solvent for the polysulfone and a filler which holds the melted polysulfone in place during the solder dipping operation.