公开(公告)号：JPH02220454A

公开(公告)日：1990-09-03

申请号：JP32982289

申请日：1989-12-21

Applicant: IBM

Inventor： ARIINA DEIISHIYU ,  MODESUTO MAIKERU OPURISUKO ,  JIYON JIEEMUSU RITSUKO ,  ROORA BESU ROSUMAN ,  HEREN RII II ,  ATORIO ZUPIITSUCHI

IPC: H01L21/66 ,  G01R31/28 ,  H01L23/544

Abstract: PURPOSE: To enable a multichip carrier to be manufacture by an economically effective method by a method wherein a thin film assembling process monitor or tooling monitor is integrally formed on one or a plurality of positions neither reducing nor interrupting the active wiring regions of a thin film device. CONSTITUTION: At least one assembling process monitor or tooling monitor for monitoring the contents of the assembling process in the case of forming a region 14 is provided in the thin film region 14. These monitors integrated with a thin film layer neither occupy nor interrupt the surface region required for a wiring region 30 to be arranged on the positions 32 near the region 30 so as to substantially equalize the electrical and physical properties. Through these procedures, the failure in process interrupting the assembling cycle can be easily detected thereby enabling the final product having economically high quality and yield to be manufactured.