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公开(公告)号:JPH04230050A
公开(公告)日:1992-08-19
申请号:JP13058791
申请日:1991-05-02
Applicant: IBM
Inventor: MAIKERU FURANKU SHINA , MITSUCHIERU SHIMONZU KOOEN , EFURAIMU BEMISU FURINTO , KAATO RUDORUFU GURIIBU , DAGURASU JIYOO HOORU , KENESU POORU JIYAKUSON , MODESUTO MAIKERU OPURISUKO
IPC: H01L21/30 , G02B6/42 , H01L21/027 , H01L21/68 , H01S5/00
Abstract: PURPOSE: To provide a highly accurate passive positioning technique suitable for positioning the several sets of objects, before providing objects on an mounting surface. CONSTITUTION: By optically positioning a reference mark 516 marked on a transparent positioning plate 500, a laser 512 and the reference marks 515 and 517 marked on a fiber carrier 511, the transparent positioning plate 500, the laser 512 and the fiber carrier 511 (one set of objects) are passively positioned. A set of the passively positioned objects are temporarily fixed by a vacuum source 504. Thus, positioning is performed accurately.
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公开(公告)号:JPH08307134A
公开(公告)日:1996-11-22
申请号:JP10309296
申请日:1996-04-25
Applicant: IBM
Inventor: FURANKU JIEI KANORA , UIRIAMU BARERU NANERII , SAIRA PONNAPATSURI , BURAIAN SUKOTSUTO OOKUREI , MODESUTO MAIKERU OPURISUKO
Abstract: PROBLEM TO BE SOLVED: To obtain a hybrid antenna which has a planar patch antenna fixed to the upper surface of an insulated planar substrate and is composed of a microstrip antenna and a reflector antenna. SOLUTION: A substrate 1 is coupled with a ground plane by means of one or a plurality of insulated coupling means so that an air gap 10 may be formed between the substrate 1 and ground plane. The outer conductor of a coaxial cable 13 which can be connected to a transmitter-receiver is coupled with the bottom face of the ground plane and the inner conductor of the cable 13 is coupled with a feeder pin 9. The pin 9 passes through the ground plane 2 and reaches the surface of a patch and fixed to the patch by soldering.
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公开(公告)号:JPH0328912A
公开(公告)日:1991-02-07
申请号:JP11885690
申请日:1990-05-09
Applicant: IBM
Inventor: BUNSEN FUAN , MODESUTO MAIKERU OPURISUKO , RITSUKII AREN RANDO
Abstract: PURPOSE: To realize a very short cycle time by using a method which converts an optical clock signal to an electric clock signal. CONSTITUTION: An optical pulse is synchronously divided into N independent optical fibers 18 by a 1/N light beam divider 16 and is divided again into M optical fibers by a 1/M light beam divider 20. This bundle of M optical fibers is coupled to each module 22 where delayed optical pulse signals from a pair of optical fibers are converted to corresponding electric clock signals, and this clock information is directly distributed to timing chips on modules but doesn't pass various passive elements having insufficient transmission characteristics, and therefore, the timing skew is minimized.
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公开(公告)号:JPH05211249A
公开(公告)日:1993-08-20
申请号:JP11070592
申请日:1992-04-03
Applicant: IBM
Inventor: GUNANARINGAMU AAJIYABARINGAMU , ARINA DOICHIE , FUADO ERIASU DOANII , BURUUSU KENESU FUAAMAN , DONARUDO JIYON HANTO , CHIYANDORASEKAA NARAYAN , MODESUTO MAIKERU OPURISUKO , SANPASU PURUSHIYOSAMAN , BINSENTO RANIERI , SUTEFUAN RENITSUKU , JIEEN MAAGARETSUTO SHIYOO , JIYANUSU SUTANISUROU UIRUKUJIN , DEBITSUTO FURANKU UITSUTOMAN
Abstract: PURPOSE: To enable simultaneous manufacture of a multi-layered thin-film interconnection structure and a ceramic substrate with a good yield by forming on a transmitting substrate a separation layer which is less formed, when reacted with a predetermined electromagnetic radiation. CONSTITUTION: A polymer layer 2 is cut off by applying an ultraviolet light 10 from a scanning layer, via a transmitting substrate 1 to the polymer layer 2. Since a metallic layer 3 acts as a reflecting layer, the ultraviolet light 10 cannot reach an interconnection structure 4. As a result of the laser cut-off, monomer pieces, that is, an emitted substance gas is trapped between the substrate 1 and reflecting metal layer 3, thus forming voids 15 within the polymer layer 2. The polymer layer 2 is formed less due to the voids 15, and thus can be separated (removed) from the substrate 1. After the structure 4 has been removed from the substrate 1, the structure 4 is supported by a metal ring (frame) 5. At this time point, the structure can be applied to an electrically good glass ceramic substrate.
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公开(公告)号:JPH0545971B2
公开(公告)日:1993-07-12
申请号:JP11885690
申请日:1990-05-09
Applicant: IBM
Inventor: BUNSEN FUAN , MODESUTO MAIKERU OPURISUKO , RITSUKII AREN RANDO
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公开(公告)号:JPH0540214A
公开(公告)日:1993-02-19
申请号:JP11769391
申请日:1991-05-22
Applicant: IBM
Inventor: MAAKU FUIIRUDEINGU BURETSUGUMA , UIRIAMU DEIIN BUREWAA , MITSUCHIERU SHIMONZU KOOHEN , GUREN UORUDEN JIYONSON , ISUMAIRU SEBUDETSUTO NOYAN , MODESUTO MAIKERU OPURISUKO , MAAKU BII RITSUTAA , DENISU RII ROJIYAAZU , JIININ MADERIN TOREUERA
IPC: G02B6/42 , G02B6/43 , H01L31/12 , H01L31/167 , H04B10/00
Abstract: PURPOSE: To provide an electrooptical connector which copes with high-density applications and meets positioning requests in a wide range and has a high optical crosstalk immunity. CONSTITUTION: A connector provided with an upper half part and a low half part 201 is provided, and each half part is provided with an LED chip 202 or 204 and a detector chip 203 or 205, and a small lens array 210 acting as an energy transfer medium is provided between two half parts to form optical connection.
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公开(公告)号:JPH02220454A
公开(公告)日:1990-09-03
申请号:JP32982289
申请日:1989-12-21
Applicant: IBM
Inventor: ARIINA DEIISHIYU , MODESUTO MAIKERU OPURISUKO , JIYON JIEEMUSU RITSUKO , ROORA BESU ROSUMAN , HEREN RII II , ATORIO ZUPIITSUCHI
IPC: H01L21/66 , G01R31/28 , H01L23/544
Abstract: PURPOSE: To enable a multichip carrier to be manufacture by an economically effective method by a method wherein a thin film assembling process monitor or tooling monitor is integrally formed on one or a plurality of positions neither reducing nor interrupting the active wiring regions of a thin film device. CONSTITUTION: At least one assembling process monitor or tooling monitor for monitoring the contents of the assembling process in the case of forming a region 14 is provided in the thin film region 14. These monitors integrated with a thin film layer neither occupy nor interrupt the surface region required for a wiring region 30 to be arranged on the positions 32 near the region 30 so as to substantially equalize the electrical and physical properties. Through these procedures, the failure in process interrupting the assembling cycle can be easily detected thereby enabling the final product having economically high quality and yield to be manufactured.
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