ANTENNA
    2.
    发明专利
    ANTENNA 失效

    公开(公告)号:JPH08307134A

    公开(公告)日:1996-11-22

    申请号:JP10309296

    申请日:1996-04-25

    Applicant: IBM

    Abstract: PROBLEM TO BE SOLVED: To obtain a hybrid antenna which has a planar patch antenna fixed to the upper surface of an insulated planar substrate and is composed of a microstrip antenna and a reflector antenna. SOLUTION: A substrate 1 is coupled with a ground plane by means of one or a plurality of insulated coupling means so that an air gap 10 may be formed between the substrate 1 and ground plane. The outer conductor of a coaxial cable 13 which can be connected to a transmitter-receiver is coupled with the bottom face of the ground plane and the inner conductor of the cable 13 is coupled with a feeder pin 9. The pin 9 passes through the ground plane 2 and reaches the surface of a patch and fixed to the patch by soldering.

    OPTICAL CLOCK INSTRUMENT
    3.
    发明专利

    公开(公告)号:JPH0328912A

    公开(公告)日:1991-02-07

    申请号:JP11885690

    申请日:1990-05-09

    Applicant: IBM

    Abstract: PURPOSE: To realize a very short cycle time by using a method which converts an optical clock signal to an electric clock signal. CONSTITUTION: An optical pulse is synchronously divided into N independent optical fibers 18 by a 1/N light beam divider 16 and is divided again into M optical fibers by a 1/M light beam divider 20. This bundle of M optical fibers is coupled to each module 22 where delayed optical pulse signals from a pair of optical fibers are converted to corresponding electric clock signals, and this clock information is directly distributed to timing chips on modules but doesn't pass various passive elements having insufficient transmission characteristics, and therefore, the timing skew is minimized.

    APPARATUS HAVING PROCESS MONITOR FOR THIN FILM WIRING AND METHOD OF PROCESS MONITORING

    公开(公告)号:JPH02220454A

    公开(公告)日:1990-09-03

    申请号:JP32982289

    申请日:1989-12-21

    Applicant: IBM

    Abstract: PURPOSE: To enable a multichip carrier to be manufacture by an economically effective method by a method wherein a thin film assembling process monitor or tooling monitor is integrally formed on one or a plurality of positions neither reducing nor interrupting the active wiring regions of a thin film device. CONSTITUTION: At least one assembling process monitor or tooling monitor for monitoring the contents of the assembling process in the case of forming a region 14 is provided in the thin film region 14. These monitors integrated with a thin film layer neither occupy nor interrupt the surface region required for a wiring region 30 to be arranged on the positions 32 near the region 30 so as to substantially equalize the electrical and physical properties. Through these procedures, the failure in process interrupting the assembling cycle can be easily detected thereby enabling the final product having economically high quality and yield to be manufactured.

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