公开(公告)号：JPH1116907A

公开(公告)日：1999-01-22

申请号：JP14774298

申请日：1998-05-28

Applicant: IBM

Inventor： ARUPU BATTAACHATSUYA ,  LEIDY ROBERT K

IPC: H01L23/52 ,  H01L21/3205 ,  H01L23/528

Abstract: PROBLEM TO BE SOLVED: To separate an element noise source from signal surfaces by a method wherein the signal surfaces are arranged between two conductive surfaces while logic levels are arranged adjacently to the first conductive surface to be connected to the signal surface through the intermediary of at least one each of the conductive surface. SOLUTION: The conductive metallic levels 34 preferably at the same potential of the logical levels as an insulator 84 insulating the individual potential levels are provided on the third layer. When e.g. copper patterns (wiring and via patterns) are adopted, the noise loss due to the wiring resistance in an element architecture can be reduced, Besides, the insulator 84 is used so as to guarantee that pertinent circuit connection only can be secured. Furthermore, a flat conductive surface 15 set up to the potential equivalent to that of the earth to be beneath another insulator 88 is provided on the metallic levels 34. On the other hand, a partial metallic level 40 above the conductive surface 15 is to be used as a circuit for transmitting signals.