MAGNETIC FIELD SENSOR AND MANUFACTURE THEREOF

    公开(公告)号:JPH08226960A

    公开(公告)日:1996-09-03

    申请号:JP28307095

    申请日:1995-10-31

    Applicant: IBM

    Abstract: PROBLEM TO BE SOLVED: To provide a bridge circuit magnetic field sensor utilizing an SV sensor. SOLUTION: This sensor is provided with a substrate, first, second, third, and fourth spin valve elements A to D, and a conductor which is formed on the substrate and is mutually connected with the four elements A to D. The elements A to D are respectively provided with a free ferromagnetic layer 36 that has a proper magnetizing axis when no magnetic field is applied, a non-magnetic spacer layer 37 adjacent to the layer 36, and a pinning ferromagnetic layer 39 adjacent to the layer 37. The magnetizing axis is pinned at a certain angle to the proper magnetizing axis of the layer 36, and four magnetizing axes of four free layers are parallel to each other substantially, the four magnetizing axes of four pinning layers 39 are parallel or inversely parallel to each other substantially.

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