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公开(公告)号：JPH02306655A
公开(公告)日：1990-12-20
申请号：JP11537790
申请日：1990-05-02
Applicant: IBM
Inventor： JIYON RICHIYAADO BIIHAN , UIRIAMU ROBAATO MIRAA , BAATO HARISON NIYUUMAN , EDOWAADO RUISU YANKOUSUKII
Abstract: PURPOSE: To provide high density electric mutual connection between a ceramics carrier and a supporting circuit board by connecting a small pin which forms an array of flexible solder column connection part on an organic circuit board to a ceramics substrate carrier. CONSTITUTION: With a pin mold 14 placed on a substrate carrier 2, an array of pin holes 16 is filled with a solder 20. Then, the substrate carrier 2 and the entire pin mold 14 pass through a furnace for melting the solder 20, to be metal-bonded to a metallized pad 12, so that an array of small pins 4 bonded to the pad 12 of the substrate carrier 2 is formed. Then the substrate carrier 2 attached with the array of small pins 4 placed on an organic circuit board 6, the assembly passes through the furnace to melt a eutectic solder 24, so that a metal bond is formed between a metallized pad 22 and the pin 4. Thus, an array of forgeable solder column connection parts 5 with good mechanical and electric characteristics is formed.
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公开(公告)号：JPH09129807A
公开(公告)日：1997-05-16
申请号：JP13997996
申请日：1996-06-03
Applicant: IBM
Inventor： JIYON RICHIYAADO BIIHAN , UIRIAMU ROBAATO MIRAA , BAATO HARISON NIYUUMAN , EDOWAADO RUISU YANKOUSUKII
Abstract: PROBLEM TO BE SOLVED: To provide a method for forming an array of electrical mutual connection between a carrier and a circuit board. SOLUTION: A pin formation template 14 containing an array of pin holes 16 corresponding to a carrier 2 is so assigned that the array of pin holes 16 matches an array 12 of a conductive pad, and, the array of pin holes 16 is filled with a solder 20 of a specified melting point, the filled solder 20 is heated and melted to be fused with the array 12 of the conductive pad, thus the array of small pin bonded to the array 12 is formed, the second solder whose melting point is lower than the specified one stuck, and, a circuit board containing, on one surface, the second array of the pad corresponding to the small pin array is assigned against the carrier 2 so that the second array matches the free end of the small pin array of the carrier 2, the second solder is reflown, and the free end of the small pin array is bonded to the second corresponding array of the conductive pad, thus a solder column connection part is formed between the carrier and the circuit board.
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公开(公告)号：JPH05230335A
公开(公告)日：1993-09-07
申请号：JP20784492
申请日：1992-08-04
Applicant: IBM
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