公开(公告)号：JPH05230335A

公开(公告)日：1993-09-07

申请号：JP20784492

申请日：1992-08-04

Applicant: IBM

Inventor： SUTEIIBUN RESURII BUTSUKUUOORU ,  ROORA RUIIZU KOSUBAA ,  BAATO HARISON NIYUUMAN ,  FURANKU RUISU PONPEIOU

IPC: C08G59/02 ,  C07D303/24 ,  C08G59/00 ,  C08G59/18 ,  C08G59/22 ,  C08G59/24 ,  C08G59/42 ,  C08G59/50 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

公开(公告)号：JPH04231474A

公开(公告)日：1992-08-20

申请号：JP10819191

申请日：1991-04-15

Applicant: IBM

Inventor： RIINA PAIBITSUKI BUTSUKUUOORUT ,  SUTEIIBUN RESURII BUTSUKUUOORU ,  TERENSU ROBAATO OTOUURU ,  RICHIYAADO RONARUDO TOMASU ,  ARUFURETSUDO BIIBETSUKU

IPC: C08G73/10 ,  C08J7/12 ,  C09D179/08 ,  C09J5/02 ,  C23C18/20 ,  C23C18/22 ,  H05K3/38

公开(公告)号：JPH04234437A

公开(公告)日：1992-08-24

申请号：JP20900291

申请日：1991-08-21

Applicant: IBM

Inventor： RIINA PAIBITSUKI BUTSUKUUOORUT ,  SUTEIIBUN RESURII BUTSUKUUOORU ,  CHIYAARUZU ROBAATO DEIBISU ,  RONARUDO DEIIN GOORUDOBURATSUT ,  JIYON EDOWAADO HAIDENRAIKU ZAS ,  SHIYARON RUIIZU NIYUUNZU ,  YAE MIYUNGU PARUKU ,  RICHIYAADO RONARUDO TOMASU ,  DOMEENIKO TORUTORETSURA ,  RUIISU MIGERU FUEREIRO

IPC: C08J3/28 ,  C23C18/20 ,  C23C18/22 ,  C23C18/30 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38

公开(公告)号：JPH06322547A

公开(公告)日：1994-11-22

申请号：JP21022593

申请日：1993-08-25

Applicant: IBM

Inventor： ARUFURETSUDO BIIBETSUKU ,  SUTEIIBUN RESURII BUTSUKUUOORU ,  UIRIAMU AASAA DONSON ,  JIYON JIYOSEFU GURENINGU ,  MAATEIN JIYOZEFU GOORUDOBAAGU ,  KUATO RUUDORUFU GURIIBU ,  KARORAIN AN KOBATSUKU ,  RINDA KARORIN MASHIYUU ,  UOORUTAA POORU PAUROUSUKII ,  MAAKU JIEFURII SHIYATSUTO ,  MAIKURU ROI SHIYOIAAMAN ,  SUTEIIBUN RIIOU TEISUDEIRU

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38

公开(公告)号：JPH03242626A

公开(公告)日：1991-10-29

申请号：JP33085790

申请日：1990-11-30

Applicant: IBM

Inventor： SUTEIIBUN RESURII BUTSUKUUOORU ,  MAATEIN JIYOZEFU GOORUDOBAAGU ,  REBATEI IIIENGAA ,  DANIERU PIITAA MORISU ,  TERENSU ROBAATO OTOUURU ,  ARUFURETSUDO BIIBETSUKU

IPC: G02F1/15 ,  C09K9/00 ,  C09K9/02 ,  G09F9/30 ,  G09G3/38 ,  H01B1/12

Abstract: PURPOSE: To obtain a display which changes in colors in a wide range and is bright with small consumption of electric power without any limit of the observation angle by using an electrochemical color-changing cell having a specified inner-molecule charge transfer salt as a color-changing agent for a display panel. CONSTITUTION: This electrochemical color-changing cell consists of a cell 2 at least a part of which is transparent and is filled with a color-changing agent 4 comprising an inner-molecule charge transfer salt of a soln. in a liquid, gel or solid phase. The cell has an indicating electrode 6 and a counter electrode 8 which face each other with a separation zone 12 between these and are connected to a variable DC power supply 10. The material 4 consists of a covalent compd. having at least one radical cationic part which makes a covalent bond with at least one radical anionic part or a material containing carbonyl groups which make conjugates with violene or cyanine part or aromatic part. In the obtd. color-changing cell, changes in colors in a wide range can be obtd. by changing the voltage applied on electrodes 6, 8.

公开(公告)号：JPH0613495A

公开(公告)日：1994-01-21

申请号：JP25563591

申请日：1991-10-03

Applicant: IBM

Inventor： RORENSU MAAKU BURAUN ,  SUTEIIBUN RESURII BUTSUKUUOORU ,  CHIYAARUZU ROBAATO DEIBISU ,  RIISA JIYANIIN HIMAARESU ,  ASHITO AABINDO MEETA ,  YUUJIIN ROOMAN SUKARUBINKO

IPC: C08L27/12 ,  C08L79/08 ,  H01L23/08 ,  H01L23/14 ,  H05K1/03 ,  H05K3/00

Abstract: PURPOSE: To provide perfluoro carbon composition of a polymer having thermal stability at the temperature at the laser processing and printed-circuit-board manufacturing at 308 nanometers. CONSTITUTION: This polymer composition has a main amount of perfluoro carbon composition, which is substantially transparent to ultraviolet rays, and a second polymer such as polyimide, which is thermally stable for imparting ultraviolet-ray processing. This is the manufacturing method for providing a forming method of the polymer composition, a through-hole for the polymer composition and the printed circuit board, including the laser removal of a via.

公开(公告)号：JPH05247198A

公开(公告)日：1993-09-24

申请号：JP28270692

申请日：1992-10-21

Applicant: IBM

Inventor： SUTEIIBUN RESURII BUTSUKUUOORU ,  CHIYAARUZU ROBAATO DEIBISU ,  RONARUDO DEIIN GOORUDOBURATSUT ,  RICHIYAADO RONARUDO TOMASU

IPC: C08G18/40 ,  B05D3/14 ,  B29C59/14 ,  C08F8/00 ,  C08F255/00 ,  C08F283/00 ,  C08G59/18 ,  C08G64/40 ,  C08G65/00 ,  C08G83/00 ,  C08G85/00 ,  C08J7/18 ,  H01L23/02

公开(公告)号：JPH02190475A

公开(公告)日：1990-07-26

申请号：JP30229589

申请日：1989-11-22

Applicant: IBM

Inventor： ARUFURETSUDO BIIBETSUKU ,  SUTEIIBUN RESURII BUTSUKUUOORU ,  UIRIAMU AASAA DONSON ,  JIYON JIYOZEFU GURENINGU ,  MAATEIN JIYOZEFU GOORUDOBAAGU ,  KUATO RUUDORUFU GURIIBU ,  KARORAIN AN KOBATSUKU ,  RINDA KARORIN MASHIYUU ,  UOORUTAA POORU PAUROUSUKII ,  MAAKU JIEFURII SHIYATSUTO ,  MAIKURU ROI SHIYOIAAMAN ,  SUTEIIBUN RIIOU TEISUDEIRU

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38