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1.发明授权Monolithic integrated memory array structure including fabrication and package therefor 失效单片集成存储器阵列结构，包括其制造和封装
公开(公告)号：US3508209A
公开(公告)日：1970-04-21
申请号：US3508209D
申请日：1966-03-31
Applicant: IBM
Inventor： AGUSTA BENJAMIN , BARDELL PAUL H , CASTRUCCI PAUL P , HENLE ROBERT A , PECORARO RAYMOND P
CPC classification number: H03K3/288 , G11C11/4113 , H03K3/286
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公开(公告)号：CA895040A
公开(公告)日：1972-03-07
申请号：CA895040D
Applicant: IBM
Inventor： PECORARO RAYMOND P , CASTRUCCI PAUL P , AGUSTA BENJAMIN , HENLE ROBERT A , BARDELL PAUL H
IPC: G11C5/04 , G11C11/40 , G11C11/411 , H03K3/286 , H03K3/288
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公开(公告)号：CA911055A
公开(公告)日：1972-09-26
申请号：CA911055D
Applicant: IBM
Inventor： BARDELL PAUL H , CASTRUCCI PAUL P , AGUSTA BENJAMIN , HENLE ROBERT A , PECORARO RAYMOND P
IPC: G11C5/04 , G11C11/40 , G11C11/411 , H03K3/286 , H03K3/288
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