Abstract:
A passivated coated semiconductor device in which a phosphosilicate layer, included to retard inversion in P-type areas or enhancement in N-type areas of the device, is supplemented by a negatively charged electrode to prevent inherent but undesirable positive mobile charges accumulated during fabrication or originated by an overlying encapsulating layer from passing through the phosphosilicate layer and reaching the P-type areas, where they could cause inversion.
Abstract:
A semiconductor device containing in a single semiconductor body a self-aligned Field Effect Transistor and a Charge-Coupled Array having an improved capacity for storing charges. The device is formed by depositing both polysilicon and silicon nitride layers over a silicon dioxide layer on the surface of a silicon body and selectively etching these layers so that suitable dopants may be diffused or ion-implanted into selected areas of the underlying silicon body to form, in the same semiconductor body, an improved charge-coupled array having an improved self-aligned Field Effect Transistor associated therewith. This process not only results in a device in which the chance of an inversion layer under the oxide on the surface of the device is substantially reduced, but also provides a self-aligned Field Effect Transistor having a thinner gate oxide and a charge-coupled array that has an increased capacity for storing charges. The improved array so formed also has, during operation, zero spaced depletion regions so that unwanted electrical discontinuities between or within the depletion regions of the charge-coupled array are avoided. Because zero spacing is achieved by using these thin conducting layers, the metal phase lines can be made narrow thus leaving openings in the charge transfer channel making the device particularly suitable for imaging applications.
Abstract:
The relative number of masks required in different levels in a mask matching process used for different processing steps to expose photoresist in arrays of patterns for semiconductor circuits on a wafer may be determined on the basis of the average number of random defects in the mask levels. This provides a way to decrease the number of comparisons that need to e made in a mask matching process without lowering the increased yield of defect-free patterns on the substrate obtained through mask matching.
Abstract:
1445450 Semiconductor data storage INTERNATIONAL BUSINESS MACHINES CORP 29 Nov 1973 [29 Dec 1972] 55360/73 Heading H1K A floating gate data storage FET 10 (Fig. 1) is coupled to conventional word driver 12, bit driver 14, and bit sense amplifier 15; and comprises a semiconductor substrate 16 of, e.g. N-doped Si having opposite conductivity diffused P doped source and drain regions 17, 18 separated by channel region 19. An insulant layer 21 of SiO 2 is formed over the substrate, etched into openings for source and drain diffusion and for the channel, and an oxide layer 24 of thickness to prevent tunnelling with normal I operating voltages is reformed in the channel opening. A gate electrode 25 of semiconductor material devoid of free carriers is deposited on the oxide layer 24 and is encapsulated in insulant 26, e.g. similar to layer 24 so as to float electrically. Contacts 27, 28 are applied to source and drain diffusions 17, 18 and an overlying drive gate electrode 29 is deposited on layer 25. Drain electrode 27 is coupled over 2-piston switch 30 to bit driver 14 and sense amplifier 15 or to earth, while source electrode 28 and substrate 16 are both earthed. Drive gate 29 is connected to word driver 12. Gate 25 may consume excess charge to create conductively a channel between source 17 and drain 18 to represent logic "1"; logic "0" being denoted by its absence. For logic "1" write in, the drain electrode 27 is switched to the bit driver 14 and sense amplifier 15 and the former is driven to produce ave pulse (Fig. 2 not shown) on the drain to backbias region 18, and a + ve pulse is applied to the gate electrode 29 from the word driver 12. Avalanche breakdown between drain region 18 and substrate 16 proximate to region 19 generates high energy electrons beneath the floating gate which pass thereto through layer 24 under influence of the prevailing electric fields and are stored. The accumulated electrons induce a channel between source and drain diffusions 17, 18 and the existence or non- existence of the source denotes the presence or absence of this electron charge. Low level read pulses on drain electrode 27 and drive gate electrode 29 enable detection of stored charge by the appearance of pulses on the sense amplifier 15. Charge is removed from the floating gate 25 to eliminate the induced channel and erase the storage by setting switch 30 to earth and negatively pulsing drive gate 29 from the word driver 12 so as to deplete the floating gate by avalanche breakedown into region 19. Plural short pulses may be used for erasure.
Abstract:
1445450 Semiconductor data storage INTERNATIONAL BUSINESS MACHINES CORP 29 Nov 1973 [29 Dec 1972] 55360/73 Heading H1K A floating gate data storage FET 10 (Fig. 1) is coupled to conventional word driver 12, bit driver 14, and bit sense amplifier 15; and comprises a semiconductor substrate 16 of, e.g. N-doped Si having opposite conductivity diffused P doped source and drain regions 17, 18 separated by channel region 19. An insulant layer 21 of SiO 2 is formed over the substrate, etched into openings for source and drain diffusion and for the channel, and an oxide layer 24 of thickness to prevent tunnelling with normal I operating voltages is reformed in the channel opening. A gate electrode 25 of semiconductor material devoid of free carriers is deposited on the oxide layer 24 and is encapsulated in insulant 26, e.g. similar to layer 24 so as to float electrically. Contacts 27, 28 are applied to source and drain diffusions 17, 18 and an overlying drive gate electrode 29 is deposited on layer 25. Drain electrode 27 is coupled over 2-piston switch 30 to bit driver 14 and sense amplifier 15 or to earth, while source electrode 28 and substrate 16 are both earthed. Drive gate 29 is connected to word driver 12. Gate 25 may consume excess charge to create conductively a channel between source 17 and drain 18 to represent logic "1"; logic "0" being denoted by its absence. For logic "1" write in, the drain electrode 27 is switched to the bit driver 14 and sense amplifier 15 and the former is driven to produce ave pulse (Fig. 2 not shown) on the drain to backbias region 18, and a + ve pulse is applied to the gate electrode 29 from the word driver 12. Avalanche breakdown between drain region 18 and substrate 16 proximate to region 19 generates high energy electrons beneath the floating gate which pass thereto through layer 24 under influence of the prevailing electric fields and are stored. The accumulated electrons induce a channel between source and drain diffusions 17, 18 and the existence or non- existence of the source denotes the presence or absence of this electron charge. Low level read pulses on drain electrode 27 and drive gate electrode 29 enable detection of stored charge by the appearance of pulses on the sense amplifier 15. Charge is removed from the floating gate 25 to eliminate the induced channel and erase the storage by setting switch 30 to earth and negatively pulsing drive gate 29 from the word driver 12 so as to deplete the floating gate by avalanche breakedown into region 19. Plural short pulses may be used for erasure.
Abstract:
A monolithic integrated memory arrangement comprising, in combination, a plurality of individual memory cells, functionally isolated and electrically interconnected, in which each of said memory cells is object or corresponding to another memory cell mirroring mirror image, in vertical, horizontal and diagonal direction. (Machine-translation by Google Translate, not legally binding)
Abstract:
A semiconductor device containing in a single semiconductor body a self-aligned Field Effect Transistor and a Charge-Coupled Array having an improved capacity for storing charges. The device is formed by depositing both polysilicon and silicon nitride layers over a silicon dioxide layer on the surface of a silicon body and selectively etching these layers so that suitable dopants may be diffused or ion-implanted into selected areas of the underlying silicon body to form, in the same semiconductor body, an improved charge-coupled array having an improved self-aligned Field Effect Transistor associated therewith. This process not only results in a device in which the chance of an inversion layer under the oxide on the surface of the device is substantially reduced, but also provides a self-aligned Field Effect Transistor having a thinner gate oxide and a charge-coupled array that has an increased capacity for storing charges. The improved array so formed also has, during operation, zero spaced depletion regions so that unwanted electrical discontinuities between or within the depletion regions of the charge-coupled array are avoided. Because zero spacing is achieved by using these thin conducting layers, the metal phase lines can be made narrow thus leaving openings in the charge transfer channel making the device particularly suitable for imaging applications.